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High-Density Connectors feature .070 x .060 in. grid spacing.

Press Release Summary:

With low mated height of .500 in. from motherboard to row A of daughterboard, Amphenol® HDB³ Connector Series utilizes brush contact system for harsh environments. Units are available in 40-, 80-, 120-, and 160-contact arrangements, and are configurable for data rates up to 3.125 Gbps per differential pair. Mounting hardware, keys, and guide pins have been combined to minimize use of board space. RoHS-compliant version is available.

Original Press Release:

Amphenol® HDB³ Connector Series


Amphenol® HDB³ connector series offers the following:

o High density contact pattern: .070" x .060" grid spacing

o Low mated height: .500 from mother board to row A of daughter board

o Utilizes the high performance brush contact system for reliability in harsh environments

o Mounting hardware, keys and guide pins have been combined to occupy less board space

o Available in the following contact arrangements

- 40 contacts

- 80 contacts

- 120 contact

- 160 contacts

o Configurable for data rates up to 3.125 Gbps data rates per differential pair

o RoHS compliant version available

To read more about High Density HDB3 and HSB3, see catalog SL-402. For additional information on this or related products contact BLP Marketing by Phone: (800) 678-0141 and ask to speak with BLP Marketing or by Email:

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