High Accuracy Mass Imaging Takes Center Stage at Semicon West 2006
DEK's Micron-class Platform to Demonstrate DirEKt Ball Place(TM) Sphere Placement Capability
As leading packaging firms search for flexible, higher throughput manufacturing solutions to meet emerging speed and accuracy requirements, DEK continues to answer the call with innovative process technology enabled by its versatile Micron-class printing platform. Visitors to DEK's booth at the upcoming Semicon West show will see first hand how the mass imaging leader continues to break new ground with packaging technologies that use a common platform to address a multitude of applications.
Live demonstrations of the company's award-winning DirEKt Ball Placement(TM) process will be conducted throughout the 3-day event. Utilizing two in-line Micron-class platforms, this remarkable technology enables the placement of solder balls as small as 0.3mm in diameter onto substrates or wafers at repeatable first-pass yields better than 99%. The first in-line system, a Europa, uses sophisticated flux imaging technology to deposit flux precisely at each interconnect site. The second machine, a Galaxy, then utilizes a fully enclosed ball transfer head capable of holding up to 50 million solder balls to guide each solder ball directly to the surface of the stencil and seat each ball in the flux. Process cycle time is extremely fast, regardless of I/O count.
But, the Micron-class platform is not limited to ball placement and wafer bumping processes. The flexibility of the system allows easy re-deployment to host a variety of other advanced packaging applications such as backside wafer coating, thermal interface materials (TIM) deposition and encapsulation. Some of DEK's latest advanced applications include high-speed backside wafer coating of die attach materials, epoxies and protective coatings as thin as 25 microns and singulated substrate printing that allows for the individual alignment and imaging of multiple substrates or components down to 20mm in size.
To find out more about DEK's complete portfolio of packaging solutions, visit booth #7139 at Semicon West, July 11 through 13 at San Francisco's Moscone Center or log onto the company's web site at www.dek.com.
About DEK
DEK is a global provider of advanced pre-placement manufacturing solutions and innovative deposition technologies for a wide range of electronic materials. For more information, visit DEK at www.dek.com.
Company Contact
Press Contact
Neil MacRaild
DEK USA
Laura Sims
DEK USA
Tel: 408-954-8582
E-mail: nmacraild@dek.com
Internet: www.dek.com
Tel: 404-661-0348
Email: laura@simscomm.com
Internet: www.dek.com
