Promoting theme of "Path to Least Resistance" for metallization of Solar Cells
WEST CONSHOHOCKEN, Pa. – The Heraeus Photovoltaics Global Business Unit, a leader in the development of metallization pastes for solar cells, will be exhibiting at this year's Intersolar North America in San Francisco held July 14 - 16, 2015. At this year's show, Heraeus will be promoting their products and technology that support manufactures' "Path to Least Resistance" for solar cells. Heraeus will be highlighting their product offerings for conventional, PERC, n-Type, Heterojunction and 3(rd) Generation Photovoltaic applications.
From their successful SOL9621 Series, Heraeus will highlight their SOL9621M and SOL9621M* front-side metallization pastes. Released in April, the SOL9621M has demonstrated cell performance improvements relative to other pastes in this series. Alpha customer testing for LDE applications achieved up to 0.1% absolute higher cell efficiency. This is due to the reduced contact resistance and stable contact formation. The lower recombination lead to higher V(oc). The SOL9621M also has improved printability with the demonstrated ability of ultra-fine line printing, suitable for screen openings less than 40 micron. The SOL9621M* has similar performance characteristics with improved adhesion. Though not available in high volumes, Heraeus will be available to discuss their SOL9631 Lead-free pastes. This paste will have the performance of our best leaded front-side pastes with the lead-free benefit.
Heraeus' newest family of pastes is the SOL9622 Series for double printing applications. The SOL9622 Series is a modification of their very successful SOL9621 Series, designed specifically for double printing applications. Applied using an A+A format, customer trials of the SOL9622 Series, have demonstrated cell efficiency gains of 0.05% absolute relative to our SOL9621H paste. The key characteristics of the SOL9622 Series that provide higher cell performance are the improved line shape and lower contact resistance. Tests show that the SOL9622 Series has a contact resistance that is up to 19% lower than pastes in the SOL9621 Series. The SOL9622 Series also offers line widths up to 5 micron narrower, with a taller height. These paste characteristics produce cells with higher current and voltage performance. The SOL9622 Series represents our best paste for double printing applications. Though not highlighted at Intersolar NA, please contact your closest Heraeus Photovoltaics representative to obtain more information about the SOL9622 Series.
For advanced cell designs, Heraeus will highlight the SOL325 Series for PERC, SOL9350a for n-type and SOL500 Series low temperature pastes with our Clevios™ for Heterojunction and 3(rd) Generation Photovoltaic applications.
Heraeus' theme for Intersolar NA is the "Path to Least Resistance". At Heraeus, we believe that our investment in fundamental research, the strengthening of our intellectual property position and the development and customization of metallization paste solutions for our customers provide them with the ability to manufacture products that have high performance and high value. They will also have the confidence that they will have the ability to supply their customers with an uninterrupted supply of cells and modules.
Please visit Heraeus at this year's Intersolar North America in San Francisco. We will be located at Moscone West Level 1 in booth 7611.
SOURCE Heraeus Photovoltaics Global Business Unit
CONTACT: David McMullen, 610-825-6050 x 318