Heat Sinks cool 17 x 17 mm BGA packages.

Press Release Summary:

Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip.

Original Press Release:

New ATS Heat Sinks Cool 17 mm x 17 mm BGA Packages

Norwood, MA, February 28, 2007 - Advanced Thermal Solutions has introduced the ATS-590 and ATS-619, two new heat sink solutions specially designed for cooling 17 mm x 17 mm BGA packages such as Intel's 82571EB Gigabit Ethernet Controller and those found in Xilinx's Virtex-4 family. Both heat sinks maintain the component case temperature (Tcase) at or below the manufacturer's thermal specifications and help maintain long-term device reliability.

The ATS-590 heat sink is made from light-weight, black anodized, extruded aluminum and includes 10 integral linear fins to maximize cooling surfaces within the local airflow. The ATS-590 heat sink is 9.5 mm high, 25 mm square, and has a thermal resistance of just 8.42°C/W at its base in an air velocity of 1 m/s (200 ft/min). It is mounted with a pair of spring-loaded, push pin mounts for opposite corner attachment directly to the PCB. This attachment system provides mechanical stability for shock and vibration and allows for varying component heights.

The ATS-619 is also made from black anodized, extruded aluminum, and employs ATS' patent pending maxiGRIP(TM) attachment solution. This system features a plastic frame clip that snaps securely around the chip. A stainless steel spring clip runs through the fin field and fastens securely to the frame, which results in firm heat sink attachment with steady, even pressure. The ATS-619 is just 16.25 mm high and 22 mm x 24 (L x W) and has a thermal resistance of just 6.11°C/W.

ATS' maxiGRIP heat sink mounting assemblies have been certified by National Technical Systems (NTS) to meet Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and Unpackaged Drop Testing standards. Both heat sinks are also RoHS compliant.

Pricing for the ATS-590, with push pin hardware, and the ATS-619, with maxiGRIP(TM) mounting hardware, starts at under $7.00 and $14.00 respectively, per unit in volume orders. Visit www.qats.com, or call 1-781-769-2800 for more information on these and other ATS products.

About Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769- 2800.

Contact Name: Raymond Santos
Title: Marketing Development Specialist
E-mail: rsantos@qats.com

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