Heat Reactive Transfer Adhesive bonds smart card chips.
Press Release Summary:
Used for module embedding and lead frame lamination in smart card manufacturing, Thermofilm® G185A co-polyamide film permanently bonds smart card chips and reinforces security for banking and telecommunication card applications. Film exhibits optimal bonding performance on PVC, ABS, and PVC/ABS blends and will destroy card if removed. It is approved for use on SIM, dual interface, contactless, and multifunctional cards as well as passport assembly and E-passport inlay insertion.
Original Press Release:
Heat Reactive Transfer Adhesive for Smart Card Chip Bonding
Specialized Film for Module Embedding and Lead Frame Lamination
Windsor, Connecticut - February 28, 2008.... For smart card manufacturing, Scapa North America has introduced Thermofilm® G185A, a heat reactive transfer adhesive designed to permanently bond smart card chips and reinforce security. This product complies with various dielectric films including glass epoxy and polyimide.
Thermofilm G185A is a co-polyamide film ideal for banking and telecommunication card applications. The product exhibits high bonding performance on PVC, ABS, and PVC/ABS blends, and will destroy the card if removed. At just 1.8 mils thick, this transfer adhesive exceeds ISO requirements.
This product is approved for use on SIM, dual interface, contactless, and multifunctional cards as well as for passport assembly and inlay insertion in E-passports.
For additional information, contact Scapa Applications Support at (800) 653-5316, or access the Scapa North America website at www.scapana.com. Scapa North America develops innovative specialty adhesive films and tapes for a range of markets. Major markets include aerospace, automotive, construction, electronics, industrial assembly, medical, pipeline, printing and graphics and sports and entertainment.
