Heat-Activated Adhesive offers unlimited working time.
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Press Release Summary:
Suited for OEM assembly, SC 2002 NS non-sagging, 1-part epoxy adhesive bonds to fabrics, wood, steel, aluminum, ceramics, glass, and concrete. Self-leveling gel is 100% reactive, requires no mixing, offers gap-filling properties, and produces flexible bonds with thermal stability. At 275°F, SC 2002 NS has fixture time of 1 min. Fully cured bonds exhibit adhesive tensile lap shear of 2,200 psi, resist corrosion, and withstand service temperatures from -60 to 300°F.
Original Press Release:
Heat-Cured Adhesive Offers Unlimited Working Time for OEM Assembly
DANVERS, MA - Devcon's new SC 2002 NS (non-sagging) one-part epoxy adhesive bonds to a remarkable variety of substrates, including dissimilar substrates such as fabrics, wood, steel (stainless, mild-carbon, galvanized, tin-plated, or unfinished), aluminum, ceramics, glass, and concrete. Easy to use, this non-sagging, self-leveling gel (60,000 cps) has excellent gap-filling properties and produces flexible bonds with long-term durability and excellent thermal stability. SC 2002 NS is ideal for many OEM applications, such as bonding spider fabric to voice coils in the assembly of speakers, bonding end caps to filter media and bottom plates to tapping plates in the assembly of filters, and bonding stainless steel screens to frames.
100% reactive (no solvents), SC 2002 NS requires no mixing. It is heat-activated and provides unlimited working time at room temperature, offering exceptional versatility in a wide range of assembly applications. At 275° F, SC 2002 NS has a fixture time of approximately 1 minute. Fully cured bonds exhibit a typical adhesive tensile lap shear of 2200 psi (as measured on cold-rolled steel), resist corrosion, and withstand service temperatures from -60° to 300° F.
For more information, contact: David Bongiorni, Market Development Manager, Devcon, 30 Endicott Street, Danvers, MA 01923, Toll-Free: 1-800-933-8266, TEL: (978) 777-1100, FAX: (978) 774-0516, oeminfo@devcon.com, http://www.devcon.com/79.
