Headers withstand RoHS reflow temperatures.
Press Release Summary:
Suited for mid-range power applications where power density and current capacity is of concern, Mini-Fit RTC(TM) (RoHS Temperature Capable) Headers feature LCP housing capable of withstanding SMT solder-reflow temperatures to 260°C. Products feature press-fit PCB pegs and are compatible with Pb-free RoHS reflow processes. Mini-Fit Plus HCS(TM) male pins provide up to 12.0 A per circuit, and Mini-Fit locking thumb latch ensures positive locking of mating connectors.
Original Press Release:
Molex Mini-Fit RTC(TM) Headers for RoHS Reflow Temperature Capability
LISLE, Ill., November 28, 2007 - Molex Incorporated introduces Mini-Fit RTC(TM) (RoHS Temperature Capable) Headers, providing a cost-effective solution for mid-range power applications that require high-density and current-carrying capability. Designed with a high-temperature LCP housing that can withstand high SMT solder-reflow temperatures, the headers guarantee compatibility with lead-free RoHS reflow processes. Moreover, Mini-Fit RTC headers share the same features of the Mini-Fit Jr.(TM) headers, ensuring even greater compatibility and reliability. Its Mini-Fit® key design allows it to mate with standard Mini-Fit receptacles. For more information on Molex's extensive Mini-Fit product offering, visit www.molex.com/product/minifit.html.
About Molex Incorporated
Molex Incorporated is a 69-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 59 manufacturing facilities in 19 countries. The Molex website is www.molex.com.
