Gel Paste offers thermal conductivity up to 6.5 W/moK.
Press Release Summary:
Supplied in syringe to facilitate application, V30Z63MDP Series features specific volume resistance ratio up to 7.2 x 1014 Wocm, dissipation factor down to 0.0004 at 1 MHz, and breakdown voltage up to 9.6 kV/mm. RoHS-controlled substance is used to fill gaps around heat sources such as semiconductors. Other applications involve surface, underside, and lead heat sources such as ICs, as well as computer internal components, power supplies, and power transistors.
Original Press Release:
New Soft Paste-Type Thermal Gel from AAC Features Excellent Thermal Conductivity for Electronic Component Applications
New Hyde Park, New York - New soft paste-type thermal gel from Advanced Antivibration Components - AAC features excellent thermal conductivity up to 6.5W/m o K. This RoHS controlled substance is used to fill gaps around heat sources such as high-performance semiconductors. Other applications involve surface, underside, and lead heat sources such as IC's. The paste is most popular for use where it is difficult to fix sheet-type thermal gel. These applications include: computer internal components, power supplies, power transistors, and other heat producing components.
There are 3 types of gels, identified as the V30Z63MDP... Series, which come in a syringe to make for easier application of the gel. High specific volume resistance ratio up to 7.2x1014 W o cm. Low dissipation factor down to 0.0004 at 1MHz. High breakdown voltage up to 9.6 kv/mm. They contain nothing harmful and are therefore considered environment-friendly. At the AAC eStore you can check price and availability, place an online order, download 3-D models, or request a quote at anytime.
Additional technical specifications are contained in Catalog V110 available free upon request from Advanced Antivibration Components - AAC, 2101 Jericho Turnpike, Box 5416, New Hyde Park, New York 11042-5416. Phone: 516-328-3662. Fax: 516-328-3365
Web: http://vibrationmounts.com/NewProducts/Thermal_Gel.htm
