GaN-on-Diamond Wafer has gallium facing surface.

Press Release Summary:




Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mm², wafer has atomically smooth gallium facing surface and is shipped freestanding or optionally on disposable silicon wafer mount.



Original Press Release:



Group4 Labs' Develops Gallium Nitride-on-Diamond® Wafer with New Orientation



April 5, 2006 - Menlo Park, CA - Group4 Labs, LLC, an extreme materials developer and supplier, announces a gallium (Ga)-facing gallium nitride (GaN)-on-diamond semiconductor water. The new 10 mm² Ga-facing wafer is the third product in the Xero Wafer(TM) family and shares the same proprietary technology that permits a single GaN layer to be atomically attached to a synthetic diamond substrate. All three products exhibit unprecedented high temperature resilience for very high-power, high-frequency electronic, solid-state white lighting, military and photonics applications. Group4 Labs' semiconductor wafers are ideal for use in the conventional epitaxial growth of GaN and its aluminum and indium-based alloys.

The GaN-on-diamond, ground-breaking technology enables the GaN layer to be atomically attached to a freestanding, proprietary polycrystalline chemical-vapor-deposited (CVD) diamond substrate (25-microns thick). The new wafer's GaN exterior is an atomically smooth finish with a gallium-facing surface that is epi-ready for further epitaxial deposition. The wafer is shipped freestanding or optionally on a disposable, silicon wafer mount to allow easy handling during wafer processing.

The GaN-on-Diamond wafer addresses the classic heat problem plaguing the high power and high-speed transistor industry: excessive heat build-up inside the chip's engine that ultimately leads to device failure. The new wafer offers a unique solution by extricating heat from the chip's core almost at the instant that it is generated. This is due to the sub-nanometer proximity of the chip's active region to diamond, a nearly perfect thermal conductor. CVD diamond's thermal conductivity is about 3X to 30X more than that of conventional semiconductors. Just a 3X improvement in the thermal conductivity of a transistor array's substrate could boost the array's power-density by 10X to 100X depending on device configuration. Group4 Labs' scientists have for the first time, successfully attached a compound semiconductor such as GaN to the tough-to-handle diamond.

According to Group4 Labs' CEO, Felix Ejeckam, "This wafer features a Gallium-facing surface rather than the Nitrogen-facing surface which we introduced last month". He continues, "Unlike the optional N-facing version, this new surface resembles the conventional crystallographic structure that many of our customers are accustomed to using."

The new 10mm x 10mm GaN-on-Diamond wafers are currently sold for $550-$600 per unit (depending on quantity) through the company's online store (www.Group4Labs.com/Products).

Group4 Labs, LLC (Menlo Park, CA) is an extreme materials company founded in April 2003. The privately-held company develops and manufactures unusual semiconductor materials for a wide variety of applications in the advanced electronics and photonics industries. For more information, please visit www.Group4Labs.com.

More from Construction Equipment and Supplies

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers