Fujitsu to Feature Advanced 65-Nanometer Process Technology, 10 Gbps Ethernet Switch Chip at DesignCon 2007

IP Providers Transmeta and Tensilica to Join Fujitsu in Booth 833

SUNNYVALE, Calif., Jan. 26 /- Fujitsu Microelectronics America, Inc. (FMA) will feature its high-performance 65-nanometer process technology and 10Gbps Ethernet switch in booth 833 at this year's DesignCon, January 29-31, at the Santa Clara Convention Center. Two leading developers of intellectual property; Transmeta Corporation with its LongRun2 IP; and Tensilica Corporation with its Diamond Standard processor cores, will feature their IPs available from Fujitsu.

Fujitsu is now accepting ASIC designs for production using its 65nm technology (see September 12, 2006, news release, ). Fujitsu's 65nm process technology integrates 11 interconnect layers and uses advanced copper and porous low-k dielectric materials to increase device signal speeds and reduce power consumption. A chip built using Fujitsu's 65nm technology will be only 60 percent the size of the same chip built using its 90nm technology, applying the same LSI specifications.

Fujitsu's 65nm process is available through the company's CS200HP, CS200G and CS200A series. The CS200HP was developed for high-end, high-performance server CPU devices and networking designs; while the CS200G was designed for general-purpose applications that require a good balance between performance and stand-by power consumption. The CS200A is best suited for mobile products such as cellular phones, notebook computers, and other digital consumer products that require minimum power consumption.

Fujitsu will also demonstrate its MB87Q3020 single-chip, 20-port, 10Gbps Ethernet switch. The industry's first switch IC to support a direct, 10Gbps serial interface to XFP optical modules, the MB87Q3020 provides a complete solution for developing state-of-the-art network server, blade server and storage applications. The switch chip delivers 400+Gbps, non-blocking, aggregate switching bandwidth through 3Mbytes of proprietary, multi-stream shared buffer memory, with the on-chip 10Gbps serial SerDes. The SerDes technology, which was developed by Fujitsu, is available to customers.

Transmeta, Tensilica Join Fujitsu at DesignCon

Two leading IP suppliers -- Transmeta and Tensilica -- will be featured at the Fujitsu booth. Transmeta will demonstrate its LongRun2 Technologies, a suite of advanced power-management, leakage-control and process-compensation technologies for high-performance, mobile computing, wireless broadband, graphics and SoC applications.

Tensilica will provide its Diamond Standard processor cores, which range from a low-power, 32-bit controller to the industry's highest performance DSP core. The company will also showcase its multifunction audio processor, which has been designed into millions of cellular phones. These IPs are part of Fujitsu's ASIC IP offerings for integration into new ASIC designs.

"Fujitsu's proven 65-nanometer process technology, coupled with our broad portfolio of IP, provides our customers with reliable, high-performance solutions for their designs," said Kazuyuki Kawauchi, president and CEO of Fujitsu Microelectronics America. "Transmeta and Tensilica are valued IP partners, and their IPs play an important role in many of our advanced high-volume custom LSI designs."

About Fujitsu Microelectronics America

Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the networking, communications, automotive, security and other markets throughout North and South America. For more information about ASICs, please see or e-mail

Source: Fujitsu Microelectronics America, Inc.

Emi Igarashi of Fujitsu Microelectronics America, Inc.,
+1-408-737 5647,;


Dick Davies of IPRA,

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