Semiconductor Processing Equipment
FSI International Announces the ZETA® Spray Cleaning System with ViPR(TM) Technology is Now Qualified for 200mm Manufacturing
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ViPR(TM) technology eliminates ashing for highly implanted photoresist and improves yields for metal stripping following salicide processes
MINNEAPOLIS (December 9, 2008) - FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that its FSI ZETA® spray cleaning system with ViPR(TM) technology is now available for 200mm wafer processing, and an Asian customer has qualified this technology for their 200mm manufacturing. FSI's ViPR technology, originally introduced for 300mm advanced technologies, has been adopted by several 300mm fabs because of its ability to successfully strip highly implanted photoresist with a one-step wet process. In response to 200mm fabs wanting the same benefits, FSI developed the ViPR capability on its 200mm ZETA system. ViPR technology makes it possible for IC manufacturers to leverage cost and cycle time reduction by eliminating ashers and multi-step ash-wet methods, to free up space for other enabling technologies.
"We are seeing broad acceptance of our ViPR technology in advanced 300mm fabs because of its unique capabilities and benefits," said Don Mitchell, FSI chairman and CEO. "With the 200mm ViPR technology now qualified in manufacturing by one of our key Asian customers, we are pleased that the ViPR process is providing customers with the ability to upgrade their technology as well as further leverage and extend their 200mm investments."
At the November 2008 FSI Knowledge Services(TM) Seminar series held in Asia, this customer presented a very compelling examination of the 200mm ViPR capability for ash-free all wet stripping of advanced logic devices. Their strategy in implementing ViPR technology was to avoid plasma damage from ashing and to increase factory throughput. The customer stated the ZETA system ViPR stripping process met their stripping and device electrical performance goals, while reducing manufacturing cycle time up to 10% depending on the device type, which translates to significant cost savings.
In addition this customer is now characterizing 200mm ViPR technology to remove metal films used for metal silicide formation. The ZETA ViPR process is proven at 300mm to effectively remove unreacted metal without attacking the salicide. In particular, it has been demonstrated successfully on cobalt silicide strips and integrates successfully with the most advanced NiPt salicide processes that use lower annealing temperatures to reduce junction leakage, resulting in improved process yields.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the Company's broad portfolio of cleaning products, which include batch and single wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company's support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, please visit FSI's website at www.fsi-intl.com.
