Front-End Modules utilize SOI RF CMOS technology. .

Press Release Summary:



Intended for RF Front-End Module foundry market, 0.18 µm Silicon on Insulator RF CMOS technology uses thin-film SOI on trap-rich, high resistivity substrates. Technology features 2.5 V switch FET, 2.5 V CMOS, native NMOS, 1.6 KΩ/square poly resistors, 2.2 fF/um2 MIM capacitors, 4LM and 4 micron thick top metal. SOI RF CMOS process technology is optimized for antenna switches and tuners, which are core components of wireless FEMs for cellular and Wi-Fi connectivity.



Original Press Release:



MagnaChip to Offer Silicon on Insulator RF CMOS Technology



SEOUL, South Korea and CUPERTINO, Calif., – MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a 0.18um silicon on insulator (SOI) RF CMOS technology for the emerging RF front-end module (FEM) foundry market.



The SOI RF CMOS process technology is optimized for use in antenna switching and tuner applications. Switches and tuners are core components of wireless FEMs for cellular and Wi-Fi connectivity. CMOS based FEMs reduce manufacturing cost and time to market while providing competitive performance for multiband and multimode smartphones and tablets.



MagnaChip's 0.18um SOI RF CMOS technology uses thin-film silicon SOI on trap-rich high resistivity substrates for better performance than the standard SOI substrate. This technology also features a 2.5V switch FET delivering a highly competitive figure of merit of Ron*Coff/BVDSS of less than 60fs/V. This is the value range of competitive technology currently in production and is well suited for FEM applications. In addition, this technology includes 2.5V CMOS, native NMOS, 1.6Kohm/square poly resistors, 2.2fF/um2 MIM capacitors, 4LM and 4 micron thick top metal enabling a high level of integration. Also, the number of mask layers is about 30% less than that required of other comparable technologies, to provide MagnaChip customers with a cost-effective solution without compromising performance.



MagnaChip has partnered with EEsof EDA at Keysight Technologies, a leading device modeling solution provider, to provide our customers with excellent RF CMOS model extraction, generation and verification technologies.



"The cost-effective and high-performance nature of our 0.18um SOI RF CMOS technology offering is an important addition to MagnaChip's growing portfolio of advanced and high-performance process technologies for foundry customers," said Namkyu Park, Executive Vice President of MagnaChip's Semiconductor Manufacturing Services Division. He added, "MagnaChip will continue to provide innovative and differentiated technologies to meet the rapidly changing needs of our customers."



About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.



About Keysight Technologies

Keysight Technologies is a global electronic measurement technology and market leader helping to transform its customers' measurement experience through innovations in wireless, modular and software solutions. Keysight's electronic measurement instruments, systems, software and services are used in the design, development, manufacture, installation, deployment and operation of electronic equipment. The business had revenues of $2.9 billion in fiscal year 2014. Information about Keysight is available at www.keysight.com. EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF systems, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications at Keysight Technologies. More information is available at www.keysight.com/find/eesof.



CONTACTS:   

In the United States:

Robert Pursel                  

Director of Investor Relations 

Tel. +1-408-625-1262          

robert.pursel@magnachip.com



In Korea:

Chankeun Park

Senior Manager, Public Relations

Tel. +82-2-6903-3195

chankeun.park@magnachip.com



Web Site: http://www.magnachip.com


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