FCI Expands AirMax VS® Family with BGA Header
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ETTERS, PA (January 29, 2007) -FCI, a leading developer of connectors and interconnect
systems, further increases the versatility of its AirMax VS® connector system by adding the option for ball grid array (BGA) attachment to its backplane header offering. By combining FCI's proven BGA technology with its innovative shieldless high-speed connector design, the new AirMax VS vertical BGA headers now offer system designers greater flexibility in backplane design and improved electrical performance. Ideal for applications requiring components to be mounted on both sides of the backplane, the BGA termination option also enhances the highest-performing connector in the marketplace by:
o Optimizing footprint, via and routing options;
o Maximizing advanced PCB manufacturing techniques by utilizing buried and
micro-vias;
o Reducing layer count and applied cost; and
o Avoiding major backplane re-design.
The resulting system will exhibit lower insertion loss and better impedance match
through the footprint by reducing signal reflection.
"The development of BGA backplane termination is built upon the foundation of
FCI's BGA connector technology and manufacturing expertise long used on its MEG-Array®
and GIG-Array® high-speed mezzanine connectors," said John Burkett, product manager
for FCI. "Evaluations of BGA attachment in AirMax VS backplane applications performed
over the past two years have repeatedly demonstrated robust and reliable mechanical
performance in rigorous qualification tests."
The elimination of the metal shields results in a less cumbersome, lighter connector
with fewer termination points, making the AirMax VS BGA connector easier for
manufacturers to process, while the BGA signal header allows smaller vias on the
backplane, as well as the application of blind or buried vias and vertical and horizontal routing. According to Burkett, BGA termination gives manufacturers the ability to use
advanced PCB manufacturing techniques by utilizing buried and micro-vias, can reduce or
eliminate the need for backdrilling, and can also reduce layer count and total applied cost.
Utilizing air as the dielectric between adjacent conductors, the AirMax VS connector
system offers high-speed computing and networking system designers high signal density
and the industry's lowest insertion loss and crosstalk, without the use of costly and spaceconsuming
metal shields.
The Insert Molded Leadframe Assembly (IMLA) utilized in AirMax VS connectors
enables the same connector to be used for Differential Pair, Single-Ended or Power signals.
The design also allows systems to migrate from 2.5Gb/s to 25Gb/s without necessitating
redesign of the basic platform.
The AirMax VS vertical BGA header connector is initially available in configurations
providing 10 columns with 15 contacts per column, supporting 5 differential pairs per
column, with either 2mm or 3mm column spacing. These five-pair versions provide the
highest signal density available, accommodating 63 differential pairs or 95 single-ended
signals per inch.
The AirMax VS vertical BGA headers join the most comprehensive range of highspeed,
low-cost connectors available today. The AirMax VS connector family offers a
complete system of modular building blocks-including signal connector options that scale
among 3, 4 or 5 differential pairs per column along with complementary power and guide
modules-to support backplane, co-planar, I/O cabling, and mezzanine board-stacking
applications.
For more information about the AirMax VS connector system, contact FCI at 825 Old
Trail Road, Etters, PA 17319-7883; call 800-237-2374, email at electronics.us@fciconnect.com
or visit FCI on the web at www.fciconnect.com.
About FCI
With operations in 30 countries and sales of 1.28 billion euros in 2005, FCI is a leading manufacturer of
connectors. Our 13,500 employees are committed to providing customers with high-quality, innovative products
for a wide range of consumer and industrial applications.
For more information: www.fciconnect.com
