Press Release Summary:
With 10:1 mix ratio by weight, EP30LTE-LO room temperature curing epoxy system has CTE of 12 x 10-6 in./in. per Â°C. Linear shrinkage is rated at 0.0002 in./in. per Â°C, thermal conductivity is 6 BTUoin./ftÂ²ohroÂ°F, and service temperature ranges from -60 to +250Â°F. Able to bond to various metals, plastics, ceramics, and glass, EP30LTE-LO passes ASTM 595 for low outgassing. It suits applications requiring vacuum compatibility, sealant, or encapsulant.
Original Press Release:
Master Bond, Inc. Epoxy System EP30LTE-LO Now Approved for NASA Low Outgassing Specifications
Master Bond epoxy system EP30LTE-LO featuring low shrinkage, high dimensional stability and an exceptionally low coefficient of thermal expansion has passed ASTM 595 for low outgassing. EP30LTE-LO is now being used in applications requiring vacuum compatibility, sealant or encapsulant.
EP30LTE-LO offers an easy to use 10:1 mix ratio by weight with a room temperature cure. Other noteworthy properties include a CTE of 12x10-6 in/in per °C; a linear shrinkage of 0.0002 in/in per degree C, thermal conductivity of about 6 BTUoin/ft²ohro°F and a wide service temperature range of -60 to 250°F. Additionally, it bonds to a wide variety of metals, plastics, ceramics and glass. EP30LTE-LO is available in pint, quarts and gallons.
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