Press Release Summary:
TRA-BOND 933-1 one-part, filled chip encapsulant provides moisture resistance and electrical insulation. Coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests.
Original Press Release:
TRA-BOND 933-1 Chip Encapsulant!
We Have You Covered with the TRA-BOND 933-1 Chip Encapsulant
Are you frustrated with moisture damaging your microelectronic chips? TRA-CON has a solution ...... TRA-BOND 933-1! This one-part, highly filled epoxy is an excellent moisture resistant chip encapsulant. It also offers electrical insulation for even more protection. Anhydride-cured systems are put to shame by the longer pot life and lower moisture sensitivity that the TRA-BOND 933-1 provides. Its low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. Get the ultimate environmental and mechanical protection with the TRA-BOND 933-1!