Epoxy Encapsulants handles large die flip chip packages.
Share:
Press Release Summary:
Hysol FP4581 and FP4583 underfill systems adhere to SiN and polyimide and deliver combination of thermal mechanical characteristics to prevent delamination, bump fatigue, and UBM failure. With low CTE properties, Hysol FP4581 forms rigid, low stress seal that dissipates stress on solder joints. Hysol FP4583 contains fillers that are less than or equal to 2 microns in diameter and is formulated for use with overmolded components in high-lead and lead-free applications.
Original Press Release:
Henkel Launches New Series of Underfills for Flip-Chip Applications
Irvine, California, August 29, 2007
As flip chip technology proves its advantages not only for smaller footprint packages such as BGAs and CSPs but also for larger applications including ASICs and microprocessors, new materials will be required to meet the challenges associated with devices of varying sizes. To this end, Henkel has engineered Hysol® FP4581(TM) and Hysol FP4583(TM), two advanced liquid epoxy encapsulants designed for use as underfills for flip chip devices.
Hysol FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large die flip chip packages. With low coefficient of thermal expansion (CTE) properties and improved toughness over previous materials, Hysol FP4581 forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. Ideal for flip chip devices that require improved crack and fracture resistance, Hysol FP4581 offers outstanding stress protection. The material is also compatible with most no-clean flux systems.
When applications require an extremely fine filler, Hysol FP4583 is the material of choice. Embodying many of the same beneficial characteristics as its Hysol FP4581 counterpart, this material contains fillers that are less than or equal to 2 microns in diameter and has been formulated specifically for use with overmolded components in both high-lead and lead-free applications.
"The electrical efficiency and higher density benefits of flip chip technology have been well proven for smaller footprint devices," explains Dan Loskot, Director of Global Product Management, Liquids, for the electronics group of Henkel. "But, the inherent stress induced on larger die - 20 mm and above-- has made manufacturers of bigger devices a bit more cautious about the adoption of flip chip technology. Henkel's new Amine-based underfill, Hysol FP4581 changes the game, though, delivering the reliability required while allowing these packages to benefit from the advantages of flip chip technology."
In addition to the stress issues associated with flip chip applications, there have also historically been challenges with adhesion to Silicon Nitride (SiN), which is one of the most common die passivations employed by today's packaging specialists. Older generation underfill systems had difficulty adhering to SiN, thus resulting in delamination and, ultimately, catastrophic device failure. Henkel's new Amine-based underfill systems alleviate these issues by offering excellent adhesion to SiN and polyimide. Hysol FP4581 and Hysol FP4583 have been designed to deliver lower stress with the unique combination of thermal mechanical characteristics to prevent delamination, bump fatigue and UBM failure.
"Not only do these new materials offer tremendous performance benefits," concludes Loskot. "Their manufacturability is outstanding. Both products offer wide process windows, faster flow rates and longer gel times - all which correlate to more efficient, lower cost, higher reliability manufacturing."
For more information on Henkel's new Amine-based underfill systems, Hysol FP4581 and Hysol FP4583, call the 949-789-3500 or log onto http://www.henkel.com/electronics.
About Henkel
For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better and more beautiful. Henkel operates in three business areas - Home Care, Personal Care, and Adhesives Technologies - and ranks among the Fortune Global 500 companies. In fiscal 2006, Henkel generated sales of 12.740 billion euros and operating profit of 1,298 million euros. Our 52,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel.
Contact:
Henkel Corporation
Doug Dixon
Phone: 949-789-2500
Fax: 949-785-2595
doug.dixon@us.henkel.com
www.henkel.com/electronics
