Epoxy Adhesive provides die attachment.

Press Release Summary:



No. 122-38(SD) single-component, silver-filled, electrically conductive adhesive is 100% solids and syringe dispensable. It offers fine pitch resolution when syringed dispensed, stencil printed, or screen-printed. Epoxy provides adhesion to gold-plated substrates, as well as tin/lead solder-terminated components. It features chemical resistance, thermal stability to 325°C, and useful temperature range from -55 to +230°C.



Original Press Release:



Syringe Dispensable, Electrically Conductive, Epoxy Die Attach Adhesive 122-38(SD)



DESCRIPTION:
CREATIVE MATERIALS, INC. product# 122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components. This system features excellent thermal stability,
outstanding chemical resistance and excellent high temperature properties. 122-38(SD) can be used as a no lead solder replacement.

APPLICATIONS:
Some applications for 122-38(SD) include, but are not limited to:
- Die attachment
- Printed circuit board fabrication
- Advanced material composites
- Sealing and high performance coatings

STRENGTHS OF PRODUCT:

122-38(SD) is useful: 122-38(SD features excellent thermal
stability, outstanding chemical resistance and excellent high
temperature properties.

122-38(SD) is versatile: 122-38(SD) provides excellent adhesion
to gold plated substrates, as well as tin/lead solder terminated components.

For further information about 122-38(SD) and other innovative CMI products, please write or call; or visit our web site at www.creativematerials.com

SYRINGE DISPENSABLE, ELECTRICALLY CONDUCTIVE, EPOXY, DIE ATTACH ADHESIVE

DESCRIPTION: 122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit
board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.

Viscosity (cps)                          85,000
Thixotropic Index >5.0
Filler Silver
Percent Silver, cured 72
Volume Resistivity, max. (ohm-cm) 0.0002
Thermal conductivity (W/mK) 2.1
Useful Temperature Range (°C) -55 to +230
Thermal Stability (°C) Good to 325
Lap Shear Strength (psi) 2100
Glass Transition Temperature, Tg (°C) 98.7
Coef. Of Therm. Exp. (in./in./°C)
- Below Tg 38.9 x 10-6
- Above Tg 13.9 x 10-5

IONIC CONTENT:

Chloride <10 ppm.
Sodium <10 ppm.
Potassium <10 ppm.
(Typical properties are not intended to be used as specification limits.)

SUGGESTED HANDLING AND CURING: Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. Prior to using, mix container well to resuspend filler. Cure for 10 minutes at 150°C or for 15 minutes at 125°C.

STORAGE: Shelf Life: >48 hours at 25°C or 6 months at -40°C.

SAFETY AND HANDLING: Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin.

All technical information is based on data obtained by CMI personnel and is believed to be reliable. No warranty is either expressed or implied with respect to results or possible infringements on patents.

REVISION DATE: 6/25/02
REVISION: B

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