Press Release Summary:
Formulated to cure at room temperature, 2-component Supreme 11AOHT can be applied without sagging or dripping. It has mixing ratio of 1:1, operating temperature of -100 to +400Â°F, thermal conductivity of 10 BTU/in/ftÂ²/hr/Â°F, and dielectric strength of greater than 400 V/mil. Suited for applications involving thermal cycling, product adheres to most metals, ceramics, glass, rubbers, and plastics. Bonds are resistant to water, oil, and most organic solvents.
Original Press Release:
Thermally Conductive, Electrically Isolating Epoxy Resists High Temperatures
Epoxy Resists High Temperatures
HACKENSACK, NJ - Jul 3, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties. Supreme 11AOHT is a paste that can be applied without sagging or dripping even on vertical surfaces. It has a convenient mixing ratio of 1 to 1 by weight or volume. Supreme 11AOHT has a service operating temperature range of -100°F to +400°F and is well suited for applications involving thermal cycling.
Master Bond Supreme 11AOHT has high shear and peel strength. It bonds well to both similar and dissimilar substrates. This toughened compound has exceptional adhesion to most metals, ceramics, glass and most rubbers and plastics. Bonds are resistant to water, oil and most organic solvents.
Supreme 11AOHT has a thermal conductivity of 10 BTU/in/ft²/hr/°F. It has a dielectric strength of >400 volts/mil. It also exhibits a T-peel aluminum to aluminum of 15 pli and a shear strength of 1,600 psi, aluminum to aluminum.
Master Bond Supreme 11AOHT is available for use in pint, quart, gallon, 5 gallon container kits.