Press Release Summary:
Moisture-resistant TRA-BOND 789-3T3N1 is suited for side mount staking of components and any application were resistance to wicking and flow is critical. Product exhibits electrical resistance and has viscosity of over 200,000 cps. Thermal expansion coefficient ensures bonding to substrates, and product works on hard-to-bond substrates such as nickel, gold, and copper.
Original Press Release:
Need a Thix Fix?
TRA-BOND 789-3T3N1 is thixotropic version of the popular 789-3. It is a tough, moisture resistant, epoxy adhesive that exhibits superb adhesion strength and an extensive work life. This adhesive is perfect for side mount staking of components and any application were resistance to wicking and flow is critical. 789-3T3N1 has a high electrical resistance and glass transition temperature.
TRA-BOND 789-3T3N1 has a viscosity of over 200,000 cps and a thixotropic index of 4.1. It has a low thermal expansion coefficient ensuring a good bond to substrates even at high temperatures. The adhesive will work well on hard-to-bond substrates such as nickel, gold and copper.
For more information on TRA-BOND 789-3T3N1 or any other of the specialty adhesive TRA-CON has to offer contact an application engineer at 1-800-872-2661. TRA-CON has over 500 different adhesive to serve all your application needs. Visit TRA-CON on the web at www.tra-con.com