Epoxy Adhesive has low vapor pressure.

Tra-Con, Inc. Nov 28, 2001

Press Release Summary:

Two-part Tra-Bond 2116 thixotropic adhesive can be used in electronic and industrial applications where high-fill, non-sag adhesive is needed. It bonds well to many substrates including metals, glass, ceramics, wood, and plastics. Adhesive cures at room temperature, is electrical insulator, and is NASA outgassing approved. It resists chemicals and weather.

Original Press Release:

Don't Get Frustrated! TRA-BOND 2116 Will Do The Job!

TRA-CON excels in understanding customer needs, and meeting these needs in the easiest and quickest way possible. That is why we have a large variety of products to meet all of your application needs. If you are looking for a low vapor pressure epoxy, then TRA-BOND 2116 is the choice for you!

TRA-BOND 2116 is a two-part, low vapor pressure, thixotropic adhesive that is used in electronic, aerospace, and industrial applications where a high-fill, non-sag adhesive is needed. This product bonds well to many substrates including metals, glass, ceramics, wood, and many plastics.

Plus, the TRA-BOND 2116 cures at room temperature, is an electrical insulator, and is NASA Outgassing approved! As if that weren't enough, this product has excellent chemical and weather resistance.