Epoxy Adhesive cures at low temperatures.
Press Release Summary:
TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60Â° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.
Original Press Release:
TRA-BOND 400-5 Low Temperature Cure Epoxy Adhesive
Don't Let Your Epoxy Hold You Back!
TRA-BOND 400-5 is a thixotropic one-part epoxy system. This system has been developed by TRA-CON for use as a no-sag, non-drip staking and laminating adhesive. This epoxy combines the properties of a moderate working life with the ability to cure at
temperatures as low as 60 C. This epoxy also boasts excellent temperature resistance, hardness and strength. This ready to use epoxy system contains no volatile solvents.
To learn more about this or other TRA-CON products, contact our application-engineering group at 1-800-TRACON1. Our group of experts is always happy to help you find a solution for every application need.