Embedded Flash Solid State Drive has compact BGA package.
Press Release Summary:
Shock-tolerant µSSD is high-density, embedded, solid state drive that combines integrated controller with SLC Nand Flash in compact BGA package. It operates from 5 or 3.3 V power supply and features data transfer speeds of 50 MB/sec for reading and 40 MB/sec for writing. Available in 4, 8, 16, and 32 GB capacities, with leaded or lead-free solder balls, device is compatible with ATA/IDE, PCMCIA 2.1, and CF 4.1 standards.
Original Press Release:
3D Plus Announces a New Product Line: µssd
BUC, France - 3D Plus, the innovative leader in providing high density memories for
military, aerospace, space industries introduces a new commercial-off-the-shelf Solid State Drive. The µSSD is a high-density, high-performance, fully integrated, embedded flash Solid State Drive. It combines an integrated Controller with high speed performance and SLC Nand Flash in a compact BGA package.
This product is tolerant to shocks and available in industrial temperature range for applications requiring high reliability.
Here are the main features of this new family of products:
Benefits:
Example of space savings:
Discrete Approach Actual Size
QFP 72 - (Pitch : 0.50 mm)
Size : 4 x 20 x 12 + 16 x 16 = 1216 mm2 26 x 22 = 572 mm2
55% Space Savings
Number of I/Os : 21 x 4 + 86 = 170
Number of I/Os : 34
80% I/Os Savings
3D Plus "off-the-shelf" solution enables shorter lead-time than custom designs, streamlining project time-to-market.
Datasheets are available at the following address: http://www.3d-plus.com/product.php?type=4&fm=30
About 3D PLUS company:
3D Plus is a worldwide supplier of advanced high density 3-D microelectronic products and Die and Wafer Level stacking technologies meeting the demand for high reliability, high performance and very small size of today's and tomorrow's electronics.
Its portfolio of patented and very advanced stacking technologies starts with standard package scale upward to die-size and wafer-level stacking processes, and, provides its products with the capability to embed heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.
3D Plus offers catalog products upward to more complex System-In-Package (SiP) solutions and associated services.
3D Plus offers high Quality standards:
o ISO9001:2000 certification,
o Manufacturing line and capability domain qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications,
o Catalog products listed in the ESA EPPL (European Preferred Parts List) for space applications,
o Approved supplier for NASA and Jet Propulsion Laboratory (JPL) in the USA,
o Customers' specific qualifications and approvals.
With today customers spread over 30 countries, 3D Plus meets the requirements of high technology industries in industrial, computing/telecom., security and defense, avionics, medical and space markets.
The company will continue to strengthen its position in these fields.
Contact: sales@3d-plus.com
