Electroplating Service accommodates very small electronic components.

Press Release Summary:



Utilizing ultrasonic technology and continuous flow of plating solution, Spouted Bed Electrode process plates parts in chamber, rather than basket or barrel. Designed specifically for parts that have difficult geometry, are fragile, are extremely small, or have deep counter bores, SBE process produces plating distribution that is very consistent all over part, making is effective for plating with gold and nickel.



Original Press Release:



Electro-Spec Develops Innovative Technology for Plating Very Small Electronic Components



Franklin, IN, -- Electro-Spec, Inc., one of the leading specialty plating facilities in the United States, has developed a new and innovative way of plating small and/or difficult to plate electronic components. Utilizing ultrasonic technology and a continuous flow of plating solution, Spouted Bed Electrode (SBE) is a new process where parts are plated in a chamber, rather than a basket or barrel, with remarkable results.

Designed specifically to plate parts that have difficult geometry, are fragile, are extremely small, or have deep counter bores to them, the SBE process produces a plating distribution that is very consistent all over the part, making it the most effective and efficient way of plating with gold and nickel.

Parts move through the plating head in a manner similar to parts caught in a fountain. Plating takes place only in the bottom cone of the plating head (the base of the fountain). Parts caught in the fountain stream are retuned to the plating bed by means of a deflector plate, a process which occurs under solution to ensure no parts are damaged. This approach eliminates issues with parts coupling or nesting together, and part movement within the plating head provides a uniform thickness distribution superior to that of barrel plating.

"The biggest improvement is the ability to plate smaller parts, fragile parts, and parts that have deep recesses, counter bores, and blind holes to them. This has plagued the connector industry for a long time," stated Jeff Smith, President of Electro-plate. "We would like to educate RF/Microwave connector companies about this process and how it could potentially apply to their product."

For more information on our Spouted Bed Electrode Plating Technology or to request quote, visit our website at www.electro-spec.com, email us at services@electro-spec.com , or call us at 317-738-9199.

About Electro-Spec, Inc.

Electro-Spec is continually recognized as one of the leading specialty plating facilities in the United States. With a customer base from North America to Asia and Europe, Electro-Spec is synonymous with high quality and high reliability Gold, Silver, Nickel, Copper and Tri-M3(TM)(Tri-Alloy) electroplating.

Our next-generation plating lines and waste treatment system give us precise control of all phases of plating and production. Technologically advanced hardware and software allows us to monitor time, temperature, current density, filtration, flightbars, substrates, thicknesses, and solution levels throughout our facility. Statistical process information is constantly updated to spreadsheets, allowing complete accountability and traceability.

In concern for the environment, our capabilities in plating and waste treatment are enhanced by our closed-loop processes. Our vacuum vapor degreasers, plating lines and waste treatment systems all encapsulate their by-products for regeneration and recycling, giving us the ability to re-use much of the waste we generate. Water quality and air quality throughout our facility consistently exceeds even the most stringent guidelines.

We take our commitment to our customers, vendors, employees and environment seriously. We believe that either in doing business with us or working for us, that commitment is ever-present. Electro-Spec is truly a leader in the plating industry, but it is our commitment that will allow us to grow and prosper for many years to come.

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