Electronic and Optical Test and Measurement Equipment under One Roof

GOEPEL electronic exhibits at SMT/Hybrid/Packaging Show in Nuremberg/Germany

At the SMT/Hybrid/Packaging show in Nuremberg/Germany GOEPEL electronic will demonstrate its uniqueness as the world’s only company providing electronic and optical test and inspection equipment as a one-stop-shop. The company’s AOI, 3D AXI and 3D SPI systems as well as the wide range of JTAG/Boundary Scan test, programming and emulation tools represent technologically leading solutions in their respective market segments.

In hall 6 at stand 410, several innovations and news from GOEPEL electronic’s product divisions will be found:

The OptiCon THT-Line AOI system now features two matrix cameras to be utilized for parallel inspection of the PCB top and bottom sides. The simultaneous THT component and solder joint inspection results in the shortest cycle times in production lines.

The OptiCon TurboLine system has been upgraded for double-sided AOI of SMD assemblies – alleviating the need for two separate AOI systems and a turning station. The system also supports inspection of pin-in-paste (THR) or selective solder joints, e.g. at connectors.

An extended XL version of GOEPEL electronic’s Boundary Scan inline programmer RAPIDO will be introduced for the first time. RPS3000-S32XL can be utilized for parallel in-system programming and test of up to 32 assemblies, providing a number of new features. A special characteristic is the support of board dimensions up to 500 mm X 500 mm.

Various new Embedded System Access (ESA) technologies such as Chip Embedded Instruments based on GOEPEL electronic’s ChipVORX® methodology, their parallel operations on several UUTs for throughput increase and much more await the interested visitors.

A special highlight is the market introduction of a new test type named “Interactive ATE” for MDA and In-Circuit test systems. This particular development enables interactive tests between Boundary Scan equipment and ATE system, with the power to execute the interaction not only for hybrid or multiplexed but also purely analogue pin cards.

Further development in the fields of Automated X-Ray Inspection (AXI) and Solder Paste Inspection (SPI) round out GOEPEL electronic’s show appearance. The 3D systems OptiCon X-Line 3D and OptiCon SPI-Line 3D have been representing the technological leading edge in their markets, offering customer benefits particularly in the areas of inspection safety, speed and handling.

About GOEPEL electronic:

GOEPEL electronic is a worldwide leading vendor of professional optical and electronic test and inspection systems. A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of the more than 7,000 system installations. Founded 1991 and headquartered in Jena, Germany, GOEPEL electronic has currently over 200 employees and generated a revenue of more than 27 Million Euro (ca. $36 Mio) in 2012. The Company has continuously been ISO9001 certified since 1996 and was honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and has been used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.

Press Contact:

GOEPEL electronic GmbH

Stefan Meissner

Goeschwitzer Str. 58-60/66

D-07745 Jena

Tel: +49-3641-6896-739

Fax: +49-3641-6896-944

Email: press@goepel.com

URL: www.goepel.com

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