Electrically Conductive Adhesive suits applications to 445°F.
Press Release Summary:
Formulated using high-purity silver flakes, Aremco-Bond(TM) 556-HTSP exhibits volume resistivity of less than 0.0004 W-cm at room temperature, and thermal conductivity of 2.2 W/m-°K. Two-part, screen-printable adhesive features 1,400 psi tensile shear strength, Shore D hardness of 88, and viscosity range of 35,000-45,000 cP. Curing in 1 hour at 350°F, product is suited for microelectronic chip bonding, semiconductor die-attach, and hybrid packaging.
Original Press Release:
Aremco-Bond 556-HTSP Electrically Conductive Adhesive Now Available
Valley Cottage, NY -
SUMMARY
Aremco-Bond(TM) 556-HTSP, a new silver-filled, screen printable, high temperature, electrically and thermally conductive adhesive developed by Aremco Products, Inc., is now used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 445°F (230°C).
FEATURES
Aremco-Bond(TM) 556-HTSP is an advanced, two-part, screen printable, electrically conductive adhesiveformulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0004 ohmcm at room temperature, and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 445°F (230°C) and intermittent use temperature is 570°F (300°C). The tensile shear strength is
1,400 psi and Shore D hardness is 88. Viscosity range is 35,000 to 45,000 cP.
Aremco-Bond(TM) 556-HTSP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350 oF. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.
Typical applications for Aremco-Bond(TM) 556-HTSP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.
Please contact Aremco's Technical Sales Department for more information about this advanced new product.
