Durable, Low Pressure Overmolded Backshell Cable Assemblies Available from API Technologies

Backshells offer improved reliability and superior strain relief

Orlando, FL – API Technologies Corp. (NASDAQ:ATNY), a leading provider of high performance RF/microwave, power and security solutions for critical and high-reliability applications, now offers durable, low pressure overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. This simplified backshell design is readily available and more cost-effective than its metal counterpart.

Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer improved reliability and a simplified specification process. There is no hard tooling required for MIL-DTL-38999 or many other standard connector interfaces and minimal tooling charges for custom configurations.  

API's proprietary overmolding technology offers superior strain relief and is designed to withstand high temperatures and harsh environments.  The backshell's molding material electromagnetically shields the cable and offers improved insulation between conductors and the conductor shell.

The overmolded backshell design encapsulates all internal wiring as well as the shield and jacket, ensuring waterproof termination.  The mold material penetrates to the connector insert, locking all wires and contacts in place.  Contacts will not recess under mechanical stress eliminating the possibility of insulation damage and short circuiting.

These overmolded backshells can reduce cost by approximately 50% compared to standard metal backshells.

Jason Russolese, EIS director of global sales and marketing, API Technologies said, "This overmolding capability allows us to assist customers with a reliable way to design hi rel cable assemblies and harnesses for harsh environments, while helping them achieve their affordability goals. Moreover, the overmolding reduces manufacturing lead times and lowers cost, all while providing a superior product to standard metal backshells. Our ability to complement this technology with our EMI filtered and custom non-filtered interconnects presents an added value to our customers unmatched in the industry today."

API Technologies' Electromagnetic Integrated Solutions (EIS) line of products include EMI filters and interconnects, ceramic capacitors, specialty connectors and cabling, power filters and film modules, as well as a line of magnetics.

To learn more about the API Technologies' EIS product lines, please visit http://eis.apitech.com, call 1-888-553-7531 or email eissales@apitech.com.

Data Sheet: http://eis.apitech.com/docs/OvermoldingDatasheet.pdf

About API Technologies Corp.

API Technologies (NASDAQ: ATNY) is an innovative designer and manufacturer of high performance systems, subsystems, modules, and components for technically demanding RF, microwave, millimeter wave, electromagnetic, power, and security applications.  A high-reliability technology pioneer with over 70 years of heritage, API Technologies products are used by global defense, industrial, and commercial customers  in the areas of commercial aerospace, wireless communications, medical, oil and gas, electronic warfare, unmanned systems, C4ISR, missile defense, harsh environments, satellites, and space. Learn more about API Technologies and our products at www.apitech.com.

For more information, please visit http://www.apitech.com or e-mail eissales@apitech.com.

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