Press Release Summary:
Supplied in PicoStar(TM) package with 0.15 mm profile, TPD2E007 can be surface-mounted to or embedded in PCBs of portable consumer electronics to deliver compact ESD protection. This back-to-back diode array allows AC-coupled data transmission without compromising signal integrity. Characteristics include Â±8 kV IEC 61000-4-2 contact discharge, Â±15 kV IEC 61000-4-2 air-gap discharge, 15 pF line to ground capacitance, and 50 nA leakage current.
Original Press Release:
Texas Instruments Introduces Products in New Picostar(TM) Package, Industry's Thinnest Package for Portable Consumer Electronics
Compact ESD protection device requires up to 80 percent less board space
DALLAS, May 7 -- Portable consumer electronics designers can save board space with integrated circuits (ICs) in the PicoStar(TM) package that Texas Instruments Incorporated (TI) (NYSE:TXN) introduced today. The ultra-thin package, about as thin as a human hair, is the first to give system designers the option to embed silicon components inside the printed circuit board (PCB) to maximize board space. Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipment. The TPD2E007, a two-channel, robust electrostatic discharge (ESD) solution, is the first device available in the ultra-thin PicoStar package. For product details and to order samples see: www.ti.com/tpd2e007-pr.
The TPD2E007 is a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Typically, ESD protection is mounted close to the connector on the PCB, but designers have the option to surface mount or embed the TPD2E007 into the board/connector. The ability to embed this ultra-thin device in the board allows designers to save 80 percent board space compared to typical ESD solutions.
Key features of the TPD2E007
-- Robust ESD protection
- +/-8-kV IEC 61000-4-2 contact discharge
- +/-15-kV IEC 61000-4-2 air-gap discharge
-- Back-to-back diode configuration for negative signal swing
-- 15-pF line to ground capacitance
-- Low 50-nA leakage current
-- PicoStar package: 0.15 mm package height
-- Reduces board space, which gives end equipment designers the option to add more components on the board
-- Thin form factor allows the device to be inserted into a board layer stack-up with minimal effort
-- Board-level cost can be reduced by embedding the device in the PCB
Availability and pricing
The TPD2E007 is available today in a 4-pin YFM package and is priced at $0.20 in quantities of 1,000. Additional TI devices will be developed in PicoStar packaging, such as the TPS62620 low-power DC/DC converter, which is sampling now and will be available in volume production in 3Q09.
Find out more about TI's ESD protection portfolio by visiting the links below:
-- Order TPD2E007 samples: www.ti.com/tpd2e007-pr
-- See TI's complete ESD portfolio: www.ti.com/esd-pr
-- Get questions answered on TI's E2E online community: http://community.ti.com/
-- Follow TI on Twitter: http://www.twitter.com/txinstruments
About Texas Instruments
Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com
Please refer all reader inquiries to:
Texas Instruments Incorporated
Semiconductor Group, SC-09056
Literature Response Center
14950 FAA Blvd.
Fort Worth, TX 76155
PicoStar is a trademark of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.