Does Weight Matter?

Epoxies, Etc. Develops Low Density Epoxy...

20-3035 Epoxy Syntactic Foam System

The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.

This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.

Key Features:
  • Low Density
  • Excellent electrical insulation
  • Low shrinkage
  • Low CTE (coefficient of thermal expansion)
  • Excellent water resistance

    Samples are available and may be requested from our website:

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