Epoxies, Etc. Develops Low Density Epoxy...
20-3035 Epoxy Syntactic Foam System
The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.
This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.
Samples are available and may be requested from our website: www.epoxies.com