Dispensing System offers gross dot placement of 45,000 dph.
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Press Release Summary:
Available as standalone or in-line system, XyflexPro®+ Dispensing System can be configured with single or dual heads, and includes multi piston pump, positive shut-off dispense units, standard auger, and MicroDot dispense units. Pipeline conveyor mode allows parallel product transfer between conveyor zones, while Line Sequence command enables smooth travel around corners when dispensing underfill, encapsulation, and micro display applications.
Original Press Release:
Speedline Technologies to Introduce New XyflexPro+ Advanced Dispensing System to Asia at SEMICON Taiwan 2005
SINGAPORE, August 10, 2005 - Speedline Technologies will introduce its new XyflexPro®+ Dispensing System for the first time in Asia at SEMICON Taiwan 2005. The new system redefines the boundaries of dispensing equipment capability by delivering an increased speed rating of more than 30% and twice the accuracy of other dispensing systems.
The new XyflexPro+ platform, along with Speedline's line of Camalot Pumps and innovative MPM Gel Flex tooling system, will be featured throughout SEMICON Taiwan 2005, booth number 914, Hall 1, September 12-14, in the Taipei World Trade Center, Taipei, Taiwan.
XyflexPro+ Debuts in Asia
"Featuring an advanced composite gantry design structure and linear drive system utilizing the latest in motion control drive technology, the new XyflexPro+ platform has the structural rigidity and control needed to attain the high performance capabilities and speed demands by the most challenging current - and future - manufacturing requirements," said Hugh Read, Speedline Technologies, Product Manager Dispensing Equipment.
Highlights of the new XyflexPro+ Dispensing System include:
o Speedline's "Total System Accuracy" specification for "Real World" material placement on a substrate relevant to a target
o Throughput increases across all dispense applications, with a faster point to point movement and the virtual elimination of Z-axis travel time
o An increase in the gross dot placement rate to 45,000 DPH
o A unique Line Sequence command for faster, smoother travel around corners when dispensing Underfill, Encapsulation and Micro Display applications
o Pipeline conveyor mode that allows parallel product transfer between conveyor zones, reducing transfer time by up to 40%
The platform's innovative architecture provides the ultimate in user flexibility, allowing the retrofitting of any option at anytime in the field as well as ability to change to and from SMT to SEMICONductor applications with minimum downtime.
Incorporating Speedline's patented dispense technology, the platform features the Multi Piston Pump, Positive shut-off Dispense Units (DU), standard auger and MicroDot DU's. Combining these with proprietary Benchmark software delivers ease of use along with the ability to precisely control dispense volumes in a system with un-paralleled speed and accuracy.
The system is available as a standalone or in-line system, and is easily configurable with single or dual heads for a wide range of dispense applications.
Camalot Pumps, MPM Gel Flex Tools Also in Spotlight
Also, throughout SEMICON Taiwan, Speedline will showcase its Camalot Multi-Piston Pump, which combines the high repeatability of a piston pump with the flexibility and continuous flow design of an auger pump, as well as its leading Camalot DU (Dispense Unit) pump technology, featuring patented positive shut-off auger technology and configurability for challenging applications.
Speedline will also focus show attention on the MPM Gel-Flex(TM) Tooling System, its innovative and cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, Gel-Flex tooling is a true conformal board-support system. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. The system is available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. It is also available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.
All of the featured solutions are immediately available. For more information, visit Speedline Technologies at SEMICON Taiwan at booth 914 Hall 1, contact your Speedline Technologies representative or, on the Net, visit: www.speedlinetech.com
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and SEMICONductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands - Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan's "2005 Surface Mount Technology Company of the Year." For more information, visit: www.speedlinetech.com or contact Speedline at:
o Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com.
o USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com;
o Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: info.europe@speedlinetech.com;
