Differential Pair Arrays provide up to 1 terabit/connector.
Press Release Summary:
Series DPAM/DPAF offers up to 168 usable signal pairs, which are on staggered layout with perimeter grounds to simplify signal routing on boards. Connector set has .394 in. mated height and features solder crimped to tails for processing. Final Inch® data is available for 168 signal pairs. Other standard sizes include 48 and 104 signal pairs.
Original Press Release:
New High Density Differential Arrays Available from Samtec with Final Inch® Data
New Samtec Differential Pair Arrays (DPAM/DPAF Series) provide performance of up to a terabit per connector with up to 168 usable signal pairs. The signal pairs are on a staggered layout with perimeter grounds to reduce the overall number of grounds needed as well as simplify signal routing on the boards.
This connector set has a 10mm (.394") mated height and features solder crimped to the tails for easier processing. The insertion and withdrawal forces of this array system are lower than most high density connectors. Final Inch® data is available for 168 signal pairs. Other standard sizes are 48 and 104 signal pairs.
Samtec simplifies specifying and use of high speed connectors by extending the concept of recommended PCB pad layouts and SPICE models beyond the connector and board interface. Samtec Final Inch® reference designs address one of the most difficult design issues on the board: the trace breakout region around high speed connectors. These copyrighted and patent-pending designs save customer design, development, and validation time and resources and are available free of charge to customers who specify and use Samtec connectors.
Pricing for Samtec's DPAM/DPAF Differential Pair Array System begins at .09¢ - .10¢ per mated line.
For more information, contact: Samtec, Inc.; P.O. Box 1147; New Albany, IN 47151-1147; Phone: 1-800-SAMTEC-9. or 812-944-6733; Fax: 812-948-5047; Internet: samtec.com; E-mail: info@samtec.com.
