Dicing System handles 100 mm sapphire wafers.
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Press Release Summary:
IX-200 Chromadice(TM) DPSS UV laser wafer singulation system can process 4 x 100 mm sapphire wafers/hr and is also suitable for wafer trimming and scribing. Providing 360° rotation, high-accuracy Z-theta capable air bearing stages enable continuous or limited travel, and include cog-free motor, zero gear backlash, and low wobble and bearing run-out. Unit achieves cuts down to 2.5 microns wide, and is available in 266 or 355 nm UVDPSS laser wavelengths.
Original Press Release:
JPSA Announces 100mm Sapphire Wafer Dicing for Higher LED Production
Manchester, New Hampshire, USA - J. P. Sercel Associates announces 100mm
sapphire wafer dicing capability developed with the IX-200 Chromadice(TM) DPSS UV
laser wafer singulation system. The ability to process larger sapphire wafers means
higher yields for LED manufacturers, according to Jeffrey P. Sercel, president.
"Our Chromadice(TM) system can process four (4) 100mm wafers per hour, compared to
the previous ten (10) 2-inch wafers per hour" Sercel said, in making the announcement.
"Since each 100mm wafer has four times as many die as a 2-inch wafer, a typical
customer will now be cutting the equivalent of sixteen(16) 2-inch wafers per hour, per
Chromadice(TM) system! That represents a dramatic increase in yields."
The IX-200 ChromaDice(TM) DPSS version is a high-precision wafer dicing (singulation)
system also suitable for wafer trimming and scribing applications. Its UV diode-pumped
solid-state (DPSS) laser system delivers high-speed wafer dicing and cutting with high
yields. The process is tolerant of wafer warp and bow and suitable for all wafer types.
New high-accuracy Z-theta capable air bearing stages make the larger wafer processing
possible, Sercel adds. "The IX-200 easily cuts the larger wafers without impinging on the
20-micron streets." The integrated Z-theta motorized stage boasts non-contact
operation - as opposed to typical worm and wheel rotary designs. In addition to offering
high precision operation, the new Z-theta stage provides 360 degrees of rotational
capability, and its Z-axis capability makes it applicable to a wide range of applications,
with the ability to accommodate wafers of varying thicknesses and diameters.
Advantages of the new rotary stage include continuous or limited travel, excellent
accuracy and repeatability, a cog-free motor for smooth motion; zero gear backlash; low
wobble and bearing run-out; and no accuracy changes over time due to gear wear.
The Class 1, fully enclosed IX-200 ChromaDice(TM) is available in 266nm or 355nm UVDPSS
laser wavelengths for a wide range of process capabilities; it can achieve cuts as
narrow as 2.5 microns in width, yielding as much as 24% more die per wafer with die
yields greater than 99%. It delivers excellent results on GaAs, Si and other materials.
JPSA products and services include UV excimer, DPSS and ultrafast laser
micromachining systems, UV and VUV laser beam delivery systems, UV laser materials
processing development, optical damage testing, and excimer laser refurbishment
services. JPSA operates a high-performance UV laser job shop as well as a systems
engineering and manufacturing business. For more information, visit www.jpsalaser.com,
or contact the company at at 220 Hackett Hill Road, Manchester, NH, 03102 USA; Tel.
603.518.3200, Fax 603.518.3298.
