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Press Release Summary:



Mobile-Media2000(TM) offers hardware platform, optimized multimedia codecs, and application firmware that integrates video, audio, voice, and imaging into single solution. CEVA-XS1200 hardware platform integrates X1620 DSP core with peripherals, system interfaces, memories, and interconnections, including 3D DMA engine, power management unit, and 4 TDM ports, as well as providing 64 KB of L1 data memory, 64 KB of L1 program memory and 2 blocks of 128 KB each of unified L2 memory.



Original Press Release:



CEVA Announces First Available Silicon of Mobile-Media2000 Solution for High-End Mobile Multimedia Applications



SAN JOSE, Calif., Jan. 24 - CEVA, Inc. (NASDAQ:CEVA), the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry, today announced the first available silicon of its Mobile- Media2000(TM) solution, the industry's first truly software-programmable multi-function platform that supports all key standards for mobile multimedia applications. The first chips were produced on a 130nm process from United Microelectronics Corporation (UMC) and exceeded 400MHz.

The Mobile-Media2000 platform's unique combination of high-performance hardware platform, a complete set of optimized multimedia codecs, and application layer firmware integrates video, audio, voice and imaging into a single fully-programmable solution. It is a comprehensive solution based on the production-proven CEVA-X1620 DSP core and an application-specific DSP subsystem, the CEVA-XS1200 core.

The platform provides designers an efficient and flexible way to develop a wide range of portable devices such as multimedia phones, Smartphones, PDAs, portable media players, digital cameras, camcorders and surveillance equipment. The powerful performance and software-programmable capabilities of Mobile-Media2000 enable it to support a range of leading-edge multimedia standards, including H.264 encoding and decoding up to D1 resolution at 30 frames-per-second without requiring hardware acceleration, while meeting the low-power specifications of portable devices.

The silicon-proven CEVA-XS1200 hardware platform integrates the CEVA-X1620 DSP core with a rich set of peripherals, system interfaces, memories and interconnections. Among the integrated peripherals are an autonomous 3D DMA engine, a power management unit, and 4 TDM (Time Division Multiplexing) ports supporting a full range of standard serial interfaces. The platform also integrates 64KB of L1 data memory, 64KB of L1 program memory and two blocks of 128KB each of unified L2 memory.

"This important milestone underscores our commitment to bring leading- edge, complete hardware and software platforms to the semiconductor industry," said Gideon Wertheizer, CEO of CEVA. "Our Mobile-Media2000 platform enriches our product portfolio to provide a portable multimedia solution optimized for emerging applications such as Mobile TV, Personal Video Players and 3G phones."

Complete feature details can be found at: www.ceva-dsp.com/products/platforms/mobile-media.php .

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information visit www.ceva-dsp.com

Source: CEVA, Inc.

CONTACT:
Richard Kingston of CEVA, Inc.,
+1-408-514-2976, or
richard.kingston@ceva-dsp.com;

Web site: www.ceva-dsp.com/

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