DEK to Show Proven Packaging Technologies, Debut New Solutions at Semicon West 2007
DEK will use this year's Semicon West event as the backdrop to showcase the company's pioneering and productivity enhancing DirEKt Ball Placement, backside wafer coating and wafer bumping solutions, as well as debut several new technologies including the M3i, Virtual Panel Carrier (VPC) and its latest developments for high volume fuel cell and solar cell production.
From booth #8811 in the West Hall of Moscone Convention Center in San Francisco, DEK's award-winning DirEKt Ball Placement process will be demonstrated live throughout the three-day event. On board DEK's Galaxy platform, the DirEKt Ball Placement system is a unique technology that allows for solder spheres to be placed at substrate- and wafer-level, enabling placement of solder balls as small as 0.2mm in diameter at 03.mm pitch and delivering first pass yields of over 99%. As DEK remains ever mindful of the constantly changing needs of package manufacturers, Galaxy DirEKt Ball Placement continues to advance beyond current market production requirements in anticipation of future needs and smaller device footprints with higher I/O counts. Visitors to the DEK booth can view first hand how this innovative technology has and continues to enable a cost-effective and high-volume alternative to traditional wafer bumping and ball placement tools.
In keeping with DEK's forward-looking technological philosophy, the company has engineered two ground-breaking new technologies - M3i and VPC-which will also be on display at the show. DEK's M3i technology is a turnkey, scalable materials management and printing system that allows high volume production of products that would otherwise not be manufacturable at high UPH. Materials are pre-loaded into precision, climate controlled cartridges, are fed through automated transfer into a specially designed ProFlow® enclosed head deposition system on-board a Europa printing platform and are then accurately and precisely imaged onto the desired substrate or device. The versatility of the system enables the materials to be stored at low temperature within the cartridges and then, if melting processes are required, heated within the ProFlow enclosed transfer head.
DEK's new Vitrual Panel Carrier (VPC) is also sure to be highlight of the show. VPC is a unique technology that builds upon the company's Virtual Panel Tooling (VPT) concept and offers manufacturers a simple and cost-effective way to streamline individual device or substrate assembly by delivering multiple component support and alignment during screen printing and all subsequent assembly processes. Instead of requiring individual component alignment for each process stage, VPC allows components to be aligned once within the patented carrier, with parts referenced throughout the entire assembly process using two global fiducials. This throughput-enhancing and cost-saving tool will also be on display in DEK's booth from July 17-19 at Semicon West.
For show delegates who are interested in learning more about high volume applications for fuel cell and photovoltaic (solar) cell production, DEK will also show its latest solutions for the manufacture of these critical components for environmentally conscious products. Founded on decades of materials deposition expertise and screens technology development, DEK is successfully delivering high accuracy, repeatable processes for fuel cell and solar cell production.
DEK invites anyone interested in learning more about its latest technologies or proven packaging innovations to visit the company at booth #8811 at Semicon West or log onto the company's web site at www.dek.com.
About DEK
DEK is a global provider of advanced pre-placement manufacturing solutions and innovative deposition technologies for a wide range of electronic materials. For more information, visit DEK at www.dek.com.
Company Contact
Karen Moore-Watts
DEK
Tel. +44 1305 760760
Email: kmoore-watts@dek.com
Internet: www.dek.com
