Cleaning Compounds and Chemicals
DEK Innovations Address Miniaturization, Cost-Efficiency Challenges
Optimized Solutions to be Showcased at Upcoming Events
At the forthcoming IPC Midwest and SMTAI International events, DEK will demonstrate why its innovative printing technologies not only address the complexities of miniaturized devices, but do so with cost-efficiency in mind. The screen printing leader's latest advances will be showcased live from booth # 608, August 22 - 23 at IPC Midwest in Schaumburg, Illinois and from both # 214, October 16 - 17 at SMTA International in Orlando, Florida, where show delegates are invited to see DEK's optimized printing solutions first-hand.
"DEK's status as the market's unquestionable stencil printing technology leader has been earned not only through our development of leading-edge products that improve the screen printing process," explains Brian Smith, DEK Americas General Manager for Electronic Assembly, "but by advancing technology in a way that also helps assembly specialists lower total cost of ownership and improve the bottom line."
Several of DEK's most recent product developments, including ProDEK, ProActiv and Nano-ProTek, will be highlighted along with the company's flagship Horizon 03iX print platform at these upcoming exhibitions. Launched earlier this year, ProDEK is a dynamic closed loop system that enables continuous alignment and cleaning frequency adjustments in real-time. Designed to dramatically reduce defects, improve throughput and lower consumables use, ProDEK works in tandem with leading SPI systems to ensure exceptionally high yield and maximum throughput.
DEK's transfer efficiency-enhancing ProActiv system will also be demonstrated at IPC Midwest and SMTAI, with booth visitors able to see and use the technology off-line in consultation with DEK's process experts. An innovation in paste transfer capability, ProActiv energizes solder paste materials, pushes past commonly accepted area ratio rules and enables consistent printing of highly miniaturized and heterogeneous assemblies.
To completely stabilize the print process and lower costs, however, proper inputs are critical. To this end, DEK has engineered a trio of process support products that ensure a good outcome. The Total Optimized Solutions system includes the award-winning Nano-ProTek stencil coating proven to raise process stability and reduce cleaning frequency, highly absorbent SMT understencil cleaning fabric and Pro XF understencil cleaning chemistry. When used in combination, these technologies can significantly improve yield and raise transfer efficiency. In fact, DEK invites show visitors to try the combo and will offer Total Optimized Solutions kits free of charge to the first three booth visitors on each day of both IPC Midwest and SMTA International.
"The electronics industry is in the midst of balancing quickly-advancing technology development alongside global economic uncertainty," concludes Smith. "DEK's printing expertise helps today's assembly firms navigate both with success."
For more information or to schedule a demo at IPC Midwest or SMTA International, call DEK at + 1-847-368-1155 or send an e-mail to rheidebrecht@dek.com.
About DEK
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at www.dek.com.
Company Contact:
Tracey Khoo
email: tkhoo@dek.com
mobile: +65 9837 0338
Press Contact:
Laura Sims
email: laura@simscomm.com
tel: 770-829-4757
mobile: 404-661-0348
