DDR3 Test System has 256 DUT parallel test capacity.
Press Release Summary:
Compatible with M6242 dynamic test handler for high-volume back-end test, T5503 8448 Channel Test Head offers max test speed of 3.2 Gbps for devices such as DDR3-SDRAM, GDDR3, and GDDR4. Optional configuration enables 256-DUT parallel test capacity for stacked DRAM; bare-die stacking technology increases pin count of DDR3-SDRAM devices. Optional pin card is available that preserves 256-DUT parallel test capacity, even for stacked high-speed DRAM.
Original Press Release:
Advantest's New DDR3 Memory Test System Configuration Offers Industry's Highest Throughput, 256-DUT Parallel Test Capacity
SANTA CLARA, Calif., May 29 -- Advantest Corporation , a leading supplier of automatic test equipment (ATE) to semiconductor manufacturers worldwide, today announced availability of its new, expanded configuration T5503 high-speed memory test system, boasting the industry's highest parallel test capability of up to 256 DDR3 devices -- double that of the previous model. The expanded configuration test system, known as the T5503 8448 Channel Test Head, is currently shipping.
-- High-Speed Memory Providers Demand High-Speed Test Equipment
Broadband communications are now widely used in households and businesses throughout the globe and expectations are growing for higher quality and larger capacity applications including video, audio, and on-line content. The demand for low-power, very high-speed memory to drive these applications is prompting the near-term transition from DDR2-SDRAM to DDR3-SDRAM. DDR3's increased performance, coupled with lower power requirements, promise to measurably enhance the capabilities of equipment such as PCs, notebooks and servers, as well as advanced consumer products such as game consoles and HDTV.
Accompanying this shift to DDR3-SDRAM is a corresponding requirement from device manufacturers for higher-speed and more accurate test capabilities, and an insistence on lowered costs for mass production of these new high-speed devices. Advantest's T5503 8448 Channel Test Head addresses these needs, delivering superior throughput and lowered test costs for high-speed manufacturing.
The new, expanded configuration of the T5503 reinforces Advantest's market leadership in the memory test solution arena by delivering a massively parallel 256 DUT test capacity and the industry's highest uptime and utilization. Coupled with Advantest's M6242 handler the T5503 provides a DDR3 test cell that delivers both performance and yield as well as lowest cost of volume production test.
-- Features and Benefits
1. Parallel test of up to 256 DDR3-SDRAM devices - The T5503 8448 Channel Test Head doubles the parallel test capacity of the earlier model T5503, making it an ideal test solution for volume production of high-speed memory.
2. Compatible with M6242 Dynamic Test Handler - Its compatibility with Advantest's most advanced test handler, the M6242, makes the T5503 part of a total solution for high-volume back-end test.
3. Optional configuration enables 256-DUT parallel test capacity for stacked DRAM - Bare-die stacking technology significantly increases the pin count of DDR3-SDRAM devices. An optional pin card is available for the expanded T5503 that preserves its 256-DUT parallel test capacity even for stacked high-speed DRAM
-- Key Specifications
Target Test Devices: DDR3-SDRAM, GDDR3, GDDR4, etc.
Parallel Test Capacity: Max. 256 DUTs
Maximum Test Speed: 3.2Gbps
System pricing begins at $1.2M.
Note: information supplied in this release is correct at the time of publication, but may be subject to change.
About Advantest
Advantest Corporation is the world's leading automatic test equipment supplier to the semiconductor industry, and also produces electronic instruments and systems. A global company, Advantest has long offered total ATE solutions, and serves the industry in every component of semiconductor test: tester, handler, mechanical and electrical interfaces, and software. Its logic, memory, mixed-signal and RF testers and device handlers are integrated into the most advanced semiconductor production lines in the world. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. Among them, Advantest America, Inc. is based in Santa Clara, CA., Advantest Europe GmbH is based in Munich, Germany, and Advantest Taiwan Inc. is based in Hsinchu, Taiwan. More information is available at www.advantest.com
CONTACT: Amy Gold, Advantest America, Inc., +1-212-850-6670, a.gold@advantest.com
