DDR3 Register is designed for memory modules.

Press Release Summary:




Manufactured on 130 nm process technology, SN74SSTE32882 integrates 28-bit, 1:2 configurable registered buffer; register; and phase-locked loop (PLL) for DDR3 registered dual in-line memory modules (RDIMMs). Clock and control outputs can be programmed with differing drive strengths. Along with full support for parity features as well as spread spectrum clocking, single-chip device offers data rates of 800-1,066 mega transfers per second (MT/s).



Original Press Release:



TI Introduces Industry's First DDR3 Register for Memory Modules



Fully-Integrated DDR3 Register Simplifies Design, Saves Power and Board Space

DALLAS (Nov. 7, 2006) - Texas Instruments (TI) (NYSE: TXN) today introduced the industry's first fully-integrated register and phase-locked loop (PLL) for DDR3 registered dual in-line memory modules (RDIMMs). This single-chip device supports high data rates of 800 mega transfers per second (MT/s) to 1,066 MT/s. The device also reduces power consumption and board space to simplify the design of next-generation DDR3 memory modules for servers and workstations. (See www.ti.com/sc06208.)

Manufactured in TI's 130-nm process technology, the SN74SSTE32882 also integrates a high-performance, low-skew buffer with the register and low-jitter PLL. Integration of the PLL eliminates the need to tune the memory module, greatly simplifying design and board layout to accelerate server and RDIMM manufacturers' market entry. Customers can also enjoy improved performance and reliability with the integration of these features.

The SN74SSTE32882 28-bit 1:2 configurable registered buffer is designed for 1.5-V VDD operation for high speed and low power consumption. One device per DIMM is required to drive up to 36 SDRAM loads. The edge-controlled circuit outputs meet SSTL_15 specifications and are optimized for terminated DIMM loads. To provide maximum flexibility and support industry-standard DIMM configurations, the clock and control outputs can be programmed with differing drive strengths.

The SN74SSTE32882 fully supports parity features as defined by Joint Electron Device Engineering Council (JEDEC). This parity function improves reliability of server systems. The SN74SSTE32882 also supports spread spectrum clocking (SSC) to reduce EMI.

"The SN74SSTE32882 is the first device on the market enabling the future of cost- and power-efficient registered DIMMs for next generation servers and high-end PCs," said Kent Novak, general manager of TI's high-speed communications group. "This device is a result of TI's analog technology leadership and cooperation with industry-leading chipset vendors, server OEMs and DIMM manufacturers."

Information on available DDR3 RDIMMs and the complete line of clock products from TI is in the Clocks and Timers Selection Guide, available at www.ti.com/clocks.

Availability

The SN74SSTE32882 is packaged in a 176-pin BGA with 0.65 mm ball pitch in an 11 x 20 grit. It is sampling today and will be in full production in 3Q2007.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com

Please refer all reader inquiries to: Texas Instruments Incorporated
Semiconductor Group, SC-06208
Literature Response Center
14950 FAA Blvd.
Fort Worth, TX 76155
1-800-477-8924

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