Press Release Summary:
Able to reduce total power for systems that use multiple memory modules, DDR3L memory modules utilize 1.35 V DDR3L DRAM and feature thermal-relief copper pour methodology PCB design. Available densities include 4 and 8 GB, and form factor options include standard height, VLP and ULP low profile ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations. Products reduce thermal dissipation up to 10Â°C on DRAM surface, benefitting systems that must run above 85Â°C.
Original Press Release:
Virtium Solves Double Refresh Rate Challenge with New Line of Low Power, Low Thermal Dissipation DDR3L Memory Modules
Virtium 4GB and 8GB DDR3L products are available in RDIMM, UDIMM, SODIMM and Mini DIMM form factors Rancho Santa Margarita, California - Virtium Technology Inc., a leading provider of storage and memory solutions for embedded systems, today announced its new line low power, low thermal dissipation DDR3L memory modules. Virtium's low power DDR3L memory modules not only reduce total power for systems that use multiple memory modules, but because they reduce thermal dissipation up to 100C on the DRAM surface, they also benefit systems that must run above 85°C. JEDEC stipulates that systems running memory beyond 85°C must double the memory self-refresh rate. Compared to other current DDR3 designs, Virtium DDR3L memory modules are able to facilitate a considerable increase in system performance by removing the double refresh rate requirement. Virtium engineering solved this important issue using a combination of its unique screening technique for lowest total electrical current (IDD), incorporating thermal-relief copper pour methodology PCB design, reducing the chip count, and utilizing 1.35 V DDR3L DRAM. Virtium DDR3L memory modules are available in 4GB and 8GB densities in a wide range of form factors including standard height, VLP and ULP low profile ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations. The company's internal test data below shows that depending upon the components used, Virtium DDR3L modules can significantly reduce power resulting in increased performance in many embedded systems.
ECC Module Density Power Reduction Range 4GB 17% to 40% 8GB 26% to 50%
"The goal of Virtium's low power DDR3L memory modules is to provide an effective, high-reliability solution for high-temperature systems that allows customers to maximize performance," said Phan Hoang, vice president of research and development at Virtium Technology. "Virtium low power DDR3L products that offer a reduced single refresh rate interval are ideal solutions for embedded applications including telecom and networking systems that are currently facing thermal challenges because they operate between 85°C to 95°C with double refresh rates." ABOUT VIRTIUM Virtium Technology is a solutions-driven provider of memory and storage products for OEMs in the networking, industrial, medical and military markets. Virtium combines first-to-market solutions with continuity of support for legacy products that meet the performance, workload and product deployment requirements of its customers. Virtium is known as a memory and storage technology innovator. The company is a driving force in the continuous development of memory module and SSD advancements that deliver density, form factor, extended temperature, ruggedization and configuration improvements. For more information on Virtium and its products, please visit www.virtium.com.