Copper Plating Additives suit memory and logic devices.

Press Release Summary:



Ultrafill(TM) 4000 series of levelers and suppressors are targeted at sub 65 nm node for interconnect metallization. Levelers allow customers to dial-in specific amounts of dopants into ultra pure copper films that enhance Via Stress Migration results. Suppressors feature wetting capabilities that deliver optimal gap filling on thin copper seed layers.



Original Press Release:



Rohm and Haas Electronic Materials Introduces New Copper Additives Targeted at Sub-65 nm Node Memory and Logic Devices



MARLBOROUGH, MA, April 19, 2006 - Rohm and Haas Electronic Materials, Microelectronic Technologies, a leading supplier of advanced lithography materials for the semiconductor industry, announced the development of its new Ultrafill(TM) 4000 series of levelers and suppressors targeted at the sub-65 nm node for interconnect metallization.

Rohm and Haas Electronic Materials has been a leading innovator of metallization products for the electronics industry for decades. Recently, its Microelectronic's researchers successfully optimized copper plating additives, allowing customers to "dial-in" specific amounts of dopants into ultra pure copper films. This exclusive feature of the Ultrafill(TM) L-4000 series of levelers enables improved Via Stress Migration (VSM) results.

"Our new levelers allow customers to precisely 'tune' the copper morphology, bringing a higher degree of accuracy and capability to advanced processing," said Robert Mikkola, Copper program manager for Microelectronic Technologies. "And in the suppressor area, our new family of products features superior wetting capabilities that lead to improved gap filling on thin copper seed layers, delivering enhanced reliability for both logic and memory customers," said Mikkola.

The Ultrafill(TM) L-4000 series of levelers and suppressors were developed over the past two years in conjunction with major copper tool suppliers and direct interaction with IC customers. They were designed to flex the existing copper platform and to provide optimal performance in the extremely demanding sub-65 nm node.

"These materials will provide our customers with the technical solutions they require for sub-65 nm devices" said Dr. Yi Hyon Paik, president of Microelectronic Technologies. "We are very excited to offer these new products not only for our Logic customers, but for Memory customers as they adopt copper in their advanced devices," Paik said.

About Rohm and Haas Company
Rohm and Haas is a global leader in the creation and development of innovative technologies and solutions for the specialty materials industry. The company's technologies are found in a wide range of markets including: Building and Construction, Electronics, Industrial Process, Packaging, Transportation, Household and Personal Care, Water, Food and Retail and Paper. Its technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, Pa, the company generated annual sales of approximately $8 billion in 2005. Visit www.rohmhaas.com for more information. imagine the possibilities(TM)

About Rohm and Haas Electronic Materials
Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing and advanced packaging industries, its products and technologies are integral elements in electronic devices around the world. Additional information about Rohm and Haas Electronic Materials can be found at electronicmaterials.rohmhaas.com.

CONTACT:

Jeremy Cole
Rohm and Haas Electronic Materials
Phone: 508-229-7047
E-mail: jfcole@rohmhaas.com

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