Press Release Summary:
With thickness down to 280 Âµm, KSW ThinlamÂ® enables manufacturers to produce HF and UHF RFID cards with more layers for security. Manufactured without chip modules, unit can be used for any contactless personal identification application. Available with optical characteristics, it can also be used for transparent RFID cards.
Original Press Release:
Thin - Thinner - Thinlam®
The revolutionary Thinlam®, a contactless prelaminate for RFID applications, joins the broad portfolio of innovative products launched this year by the global leader in RFID tag components
Dresden, Germany, November 29, 2008 -KSW Microtec AG successfully launched Thinlam®, the contactless prelaminate for RFID card and government applications. Thinlam® is the latest in a series of new products launched from KSW Microtec this year, confirming the company¹s position as dynamic innovator and setter of standards in the RFID industry.
The new KSW Thinlam®, with a thickness down to 280µm, sets new standards for card manufacturing. It enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high value features into cards. The exceptional thinness is achieved by manufacturing the Thinlam® without chip modules - which also results in smoother card surfaces and better printing outcome. Thinlam® maintains the highest durability thanks to its unique patented chip connection technology. In addition, due to the consistently reproducible antenna geometries, KSW Thinlam® achieves tighter resonance frequency tolerances. Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® and can also be used for transparent RFID cards thanks to its excellent optical characteristics.
Thinlam® is the ideal solution for any contactless personal identification application where security, performance and design are important. Presented at Cartes & Identification and at ID WORLD, it received great feedback from partners, customers and visitors at both shows and is now available in volume quantities.
Other major product introductions from KSW this year include the new eGO dual frequency (HF/UHF) contactless transponder, the improved RFID-based VarioSens® Label with integrated temperature sensor and the contactless payment RFID sticker for mobile phones.
KSW combines in-depth technological expertise with the latest production techniques and has established itself as one of the most efficient and at the same time most flexible manufacturers of RFID components on the market. The company maintains close relationships with its customers in order to provide the highest quality RFID products that best suit the specific environments in which they are used.
KSW Microtec AG, with its headquarters in Germany, is the world's leading supplier of RFID (Radio Frequency Identification) components for special and standard applications such as public transport, ePayment, asset management, access control and high security applications. KSW combines successful high-end wafer processing, extremely efficient assembly technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994 and has clean room production facilities in Germany. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena.
For more information see: www.ksw-microtec.de