Contactless Credit Card Inlays are offered in sheet format.

Press Release Summary:



Contactless credit card inlays in sheet format feature PET substrate, which allows them to be directly laminated into PVC layers. ICs on RFID inlays are attached using palladium bump technology, which provides connection between chip and aluminum antenna. Inlays are available in several sheet formats and with range of different microcontrollers.



Original Press Release:



KSW Microtec Introduces Contactless Credit Card Inlays in Sheet Format



Dresden, Germany, February 21, 2008 - KSW Microtec, one of the world's leading suppliers of RFID components, introduces contactless credit card inlays in sheet format that expand manufacturing options for card makers. The new inlays provide the same quality and performance as KSW's inlays for reel-to-sheet manufacturing, already proven by more than 20 million contactless credit cards in the US market alone.

Thanks to KSW's special PET substrate, the new sheet inlays can be directly laminated into PVC layers for fast, reliable and cost-effective card production. The ICs on the RFID inlays are attached using KSW's palladium bump technology, which generates an extremely reliable connection between chip and the aluminum antenna for a long inlay life span.

KSW's new inlays are available in several sheet formats and with a range of different microcontrollers. KSW also offers the inlays with customized antennas and sheet form factors.

The advantages offered by the new sheet inlays to contactless credit card manufacturers are also available to UHF card suppliers. KSW provides UHF RFID inlays in sheet format for conversion into UHF PVC cards. Applications include border crossing and other long read range access control solutions.

KSW inlays are shipped using specially-designed packaging for safe transport and maximum product integrity and reliability.

About KSW
KSW Microtec AG, with its headquarters in Germany, is the world's leading supplier of RFID (Radio Frequency Identification) components for special and standard applications such as public transport, asset management and high security applications. KSW combines successful high-end wafer technology, extremely efficient assembly technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994, has clean room production facilities in Germany and is now employing 60 staff. For more information see: www.ksw-microtec.de

For further information, please contact:

Sabine Kuechler
KSW Microtec AG
Manfred-von-Ardenne-Ring 12
01099 Dresden - Germany
Tel: +49 351 889 60 28
Fax: +49 351 889 60 11
sabine.kuechler@ksw-microtec.de
www.ksw-microtec.de

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