Connectors are optimized for use in 85 ohm environments.
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Press Release Summary:
AirMax VS® connectors minimize impedance discontinuities and unacceptable signal loss when inserted in 85 ohm channels. Mating interfaces also satisfy demands for backwards compatibility to legacy 100 ohm product interfaces. Supporting Intel QPI (Quick Path Interconnect) links, standard connector configurations include vertical and right-angle header and receptacle modules. Products comply with differential insertion loss, impedance, and crosstalk requirements.
Original Press Release:
FCI Announces AirMaX VS® Connectors Optimized for Use in 85 ohm Environments
ETTERS, PA (May 12, 2009) -- FCI, a leading developer of connectors and interconnect systems, is expanding the application range of its popular AirMax VS® high-performance connector system with the addition of connectors that are optimized to minimize impedance discontinuities and unacceptable signal loss when inserted in 85-ohm channels. The connectors' mating interfaces also satisfy demands for backwards compatibility to legacy 100-ohm product interfaces ensuring a smooth transition to next-generation designs.
"Since FCI and Intel presented "Improving System Performance by Reducing System Impedance to 85 Ohms" at the February 2007 DesignCon conference, systems employing 85-ohm channels have moved from being a topic of technical discussions to reality," said James Lim, global product marketing manager.
In 2009, new-generation server platforms now provide support for 5 GT/s PCI Express® links and Intel® Quick Path Interconnect (Intel® QPI) links between processors or processors and I/O controllers. With the Intel® QPI architecture offering transfer rates of 6.4 Gb/s to > 8 Gb/s per lane, memory bandwidth utilization is significantly lower, enabling multiple bi-directional 10 GbE ports in a server.
FCI has developed several high-performance AirMax VS 85-ohm connectors to support Intel QPI links. Standard connector configurations include vertical and right-angle header and receptacle modules to enable right-angle and coplanar connections. These products have been tested and fully comply with differential insertion loss, impedance, and crosstalk requirements defined in the Intel QPI connector specifications.
Each insert-molded, lead-frame wafer provides 15 contacts, capable of supporting five highspeed differential signal pairs per column. Connectors can be supplied with insert-molded, lead-frame wafers on either 2mm or 3mm column pitch. Connector configurations with 3 differential signal pairs per column are also under development with some connector types available now in sample quantities.
For more information, contact FCI at 825 Old Trail Road, Etters, PA 17319-9351; call 800-237-2374, email at electronics.us@fci.com or visit FCI on the web at http://www.fciconnect.com/highspeed.
Intel® is a registered trademark of Intel Corporation. PCI Express® is a registered trademark of PCI-SIG.
About FCI
With operations in 30 countries and sales of 1.25 billion euros in 2008, FCI is a leading manufacturer of connectors. Our 13,000 employees are committed to providing customers with high-quality, innovative products for a wide range of consumer and industrial applications. For more information: www.fci.com
