Press Release Summary:
Syon(R) Tru-Bond(R) 206A, 214, 215, and Tru-Cast(R) III electrically conductive adhesives and potting compounds can be used to form conductive paths in applications where hot soldering would be impractical. They also provide thermal conductivity and can be used to bond or seal components or wiring in applications requiring heat dissipation. Low-shrink and nonshrink epoxy and epoxide formulations mix and pour easily, fill voids, and cure with minimal air entrapment.
Original Press Release:
Conductive Adhesives and Potting Compounds
DANVERS, MA - Syon(R) electrically conductive adhesives/potting compounds from Devcon can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. Syon thermally conductive adhesives/potting compounds offer exceptional thermal conductivity and can be used to bond or seal electrical components or wiring in applications requiring heat dissipation. These low-shrink and nonshrink epoxy and epoxide formulations mix and pour easily, fill voids completely, and cure with minimal air entrapment. They provide exceptional environmental and impact resistance.
Syon Tru-Bond(R) 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is 1-3 hours. Cure time is 72 hours at 75 deg F or 2 hours at 130 deg F. Tru-Bond 206 can be used in service temperatures from -55 deg to 95 deg C.
Tru-Bond 214 Silver-Filled Epoxy Adhesive is a conductive, nonsagging paste for applications where a conductive bond is required and where hot soldering is impractical. It can be used to form conductive paths on circuit boards and to prepare electrodes for capacitance and loss measurements. Tru-Bond 214 is also appropriate for applications requiring high thermal conductivity and meets federal specification MMM-A-1931, Types I and II. Pot life is 1 hour; cure time is 24 hours at room temperature. Tru-Bond 214 can be used in service temperatures from -55 deg to 95 deg C.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is both electrically and thermally conductive. An economical alternative to silver-filled products, this nonsagging paste can be used in place of hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding and heat-sink applications. Tru-Bond 215 has a pot life of 45 minutes. Although it cures at room temperature, heating the adhesive to 150 deg F for 2 hours will speed curing and ensure maximum electrical conductivity. Tru-Bond 215 can be used in service temperatures from -55 deg to 95 deg C.
Syon Tru-Cast(R) III High-Density Potting and Casting Resin has exceptional thermal conductivity and a low coefficient of thermal expansion. This aluminum oxide-filled epoxide resin produces castings which effectively dissipate heat generated by electrical or electronic components and can be used as a structural adhesive to produce lap joints for heat-sink applications. A choice of three curing agents allows tailoring of viscosity and pot life to the intended use. Higher cure temperatures increase the tolerance of castings to heat.
For more information, contact David Bongiorni, Market Development Manager, Devcon, 30 Endicott Street, Danvers, MA 01923, Toll-Free: 1-800-933-8266, TEL: (978) 777-1100, FAX: (978) 774-0516, www.devcon.com.