Press Release Summary:
Designed for circuit assembly applications, EMS 618-116 cures in 30 min at 100Â°C or faster at elevated temperatures and forms high-strength, high-reliability conductive interconnects. This conductive adhesive, as low-temperature cure, single-part system, specifically suits static drain and EMI/RFI shielding applications.
Original Press Release:
Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications
DELAWARE, OHIO – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.
EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures. EMS 618-116 forms high-strength, high-reliability conductive interconnects.
The EMS 618-116 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
For more information about the EMS 618-116 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.