Press Release Summary:
With 2.2 Btu-in./hr/ftÂ²/Â°F thermal conductivity, Master Sil 150 is 2-part, condensation cured liquid silicone system which can be used for potting and encapsulation. It features Shore A hardness of 40, 230% elongation at break, 11 x 10-4 cm/cmÂ°C thermal expansion, and less than 0.4% linear shrinkage. Able to protect sensitive electronic components/assemblies from dust, moisture, ozone, thermal shock, and vibration, product cures in contact with virtually all types of materials.
Original Press Release:
Condensation Cured Silicone Available for Potting and Encapsulation to 400°F
Hackensack, NJ. May 28, 2008-A two part, condensation cured liquid silicone system called Master Sil 150 has been developed by Master Bond, Inc., Hackensack, NJ. It can be used for the potting and encapsulation of voltage regulators, high voltage transformers, as well as optical and electronic assemblies. Master Sil 150 has good thermal stability combined with excellent flexibility. It has a Shore A hardness of 40 and its elongation at break is 230%. Low viscosity ensures complete fill-in around complicated parts to provide excellent electrical insulation and resistance to shock. The coefficient of thermal expansion is 11 x 10-4 cm/cm°C and its linear shrinkage is less than 0.4%.
Upon the addition of the curing agent, Master Sil 150 cures at room temperature to a tough, resilient silicone rubber. Its unique mechanical and electrical properties protect sensitive electronic components and assemblies from dust, moisture, ozone, thermal shock and vibration. Master Sil 150 has a service temperature range from -50°C to over 205°C (-55°F - 400°F). Its excellent thermal conductivity, 7.5 x 104 cal/cm.s °C (2.2 BTU-inch/hour-ft²-°F) highly facilitates its use in potting and encapsulation applications. The electrical insulation properties include a volume resistivity of 5 x 1014 ohm cm, a dielectric strength of 18 KV/mm together with a 2.9 dielectric constant and 3 x 10-3 dissipation factor at 1MHz. Master Sil 150 will cure in contact with virtually all types of materials without inhibition.
About Master Bond's Potting and Encapsulation Compounds:
Master Bond's potting and encapsulation materials are designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact and thermal shocks Master Bond's rigid and flexible epoxies, polyurethanes and silicone compounds feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and dissipation factors.
For further information please visit us at: www.masterbond.com/produse/produse_pe.html
contact: James Brenner. Phone: 201-343-8983Fax: 201-343-2132E-mail: firstname.lastname@example.org
154 Hobart Street
Hackensack, New Jersey 07601-3922