Computer-on-Module operates from -40 to +85 deg C.

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Original Press Release:

Core(TM) 2 Duo COM Express Module Targets 'Extreme Rugged' Apps

SAN JOSE, Calif., April 9, 2008 /-- Ampro Computers Inc., a leading supplier of board-level embedded computers, today announced availability of the industry's first "extreme rugged" computer-on-module (COM) based on Intel's Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, RAM, graphics, networking, PCI Express expansion, and more in a 3.7 x 4.5-inch module that operates from -40 to +85 degrees Celsius. "With its unique mix of high integration, performance, reliability, and ruggedness, Ampro's COM 840 truly leads the COM Express pack," said Ampro CTO Rick Lehrbaum. "We expect this exciting new module to be embedded in a wide range of fixed, portable, and mobile applications, such as military field training simulation, commercial avionics instrumentation, and medical imaging devices." The heart of the COM 840 is a 1.66GHz Intel(R) Core2 Duo L7500 processor with 4 MB of on-chip L2 cache, 800 MHz FSB (front side bus), and two SODIMM sockets for up to 4 GB of DDR2 RAM. The board's built-in graphics display subsystem utilizes Intel's GMA950 with 224MB of 64-bit video RAM, and can drive CRTs, flat panels, and wide screen digital TVs at resolutions of up to 2048x1536 including 1920x1080 at 85 Hz (HDTV) on CRTs. An onboard video encoder adds TV-out capabilities such as HDTV (420p, 720p, and 1080I), Component, and S-Video. The highly-integrated COM 840 also packs a broad complement of I/O, including gigabit Ethernet port, eight USB 2.0 channels, an AC97/HD audio controller, and two SATA II and one UDMA EIDE interfaces. Consistent with the COM Express standard, the board also provides flexible expansion via five PCIe x1 lanes, a PEG (PCIe graphics) x16 lane, PCI, and LPC (low pin count) buses. The x16 lane can alternately serve as a pair of SDVO (serial digital video output) channels. To satisfy the ruggedness and reliability demands of applications in military, transportation, aviation, and other harsh environments, the COM 840 is also designed -- from its 0.093-inch-thick PWB (printed wiring board) up -- to operate over an extended temperature range (-40 to +85 degrees C), and to withstand stringent shock, vibration, and HALT (highly accelerated life test) requirements. Ampro supports the COM 840 with a full range of popular embedded and desktop operating systems, including a full Linux 2.6-based distribution (derived from Ubuntu packages), Windows Embedded CE 6.0, Windows XP Embedded, and VxWorks 6.x. Availability Shipments of the COM 840 will commence within 45 days. The company will demonstrate the module in booth 1638 the Embedded Systems Conference April 15-17 in San Jose, CA. For further information visit www.ampro.com/. About Ampro Computers Inc. Now celebrating its 25th year in business, Ampro is renowned as a pioneer in the "embedded PC" industry. The company originated the PC/104, PC/104-Plus, and EBX standards for stackable single-board computers (SBCs), co-created the popular EPIC SBC standard, and offers the industry's first line "extreme rugged" computer-on-module (COM) products in ETX and COM Express formats. In addition to SBCs and COMs, Ampro offers a wide range of industrial computer systems and Panel PCs and supports its board- and system-level products under Linux, Windows CE, Windows XP Embedded, VxWorks, and QNX, among other OSes. Ampro markets its board- and system-level products to original equipment manufacturers in a wide range of markets including medical devices, defense electronics, industrial control systems, retail devices, avionics, and wired/wireless communications equipment. For more information visit www.ampro.com/. CONTACT: Victoria Kostka of Ampro Computers Inc., +1-408-360-4324, vkostka@ampro.com Web site: http://www.ampro.com/