VIA to showcase a number of engaging Android signage solutions based on the VIA ALTA DS
Taipei, Taiwan – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at CETW 2013 (Consumer Engagement Technology World) being held on November 6th and 7th in the Javits Convention Center, New York City. In the VIA booth #319 will be a number of innovative Android-based signage solutions from our VIA Embedded Digital Signage ISV (Independent Software Vendor) Program, which targets 3rd party software and system integration partners to work with VIA in developing customized Android digital signage solutions based on the VIA ALTA DS player.
Demos in the VIA booth will include a solution from Capital Networks which integrates dynamic NFC with the Audience digital signage solution, a new feature that allows users to take away more information from messages displayed on digital signage with a tap of their NFC-enabled phone, automatically opening a Web page associated with the message displayed on screen.
Also on display will be a touch kiosk solution developed with KioWare and a digital menu board display which includes dynamic social media engagement for consumers to act on and earn rewards from companies, closing a trackable loop between signage, the consumer and actual purchase behavior. Be sure to stop by the VIA booth to learn how VIA can help you start reaping the benefits Android has to offer for all your digital signage needs.
VIA ALTA DS
Powered by an industry standard ARM Cortex A9 SoC, the VIA ALTA DS system is a sleek, energy-efficient digital signage solution designed specifically for the Android operating system. Including a Signage Starter Kit for Android, the VIA ALTA DS is ideally suited for a number of dynamic applications including, retail signage, digital menu boards and ePosters.
For more information about the VIA ALTA DS, please visit:
For more information about CETW 2013, please visit: http://cetworld.com/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw
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