Chipsets provide multi-mode broadband features.

Press Release Summary:



Running both Windows Mobile and Linux, Snapdragon QSD8250(TM) and QSD8650(TM) combine mobile data processing, multimedia performance, and 3G wireless connectivity. Model QSD8250 supports HSPA data rates of up to 7.2 Mbps on downlink and 5.76 on uplink, with full backward compatibility, while dual-mode Model QSD8650 supports HSPA, as well as CDMA2000® 1xEV-DO Rev. B, with full backward compatibility. Both feature custom gigahertz microprocessor core paired with DSP core running at 600 MHz.



Original Press Release:



Qualcomm Premieres Snapdragon, First Chipset Solutions to Break the Gigahertz Barrier with Multi-Mode Broadband and Multimedia Features



- Company Showcases First Two Products from Snapdragon Family for Next Generation Mobile Computing at New York Analyst Meeting Today -

SAN DIEGO, Nov. 14 /- Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it is delivering the first groundbreaking chipset products from the Snapdragon(TM) platform to numerous device manufacturers. The QSD8250(TM) and QSD8650(TM) are now shipping to customers worldwide, offering an unprecedented combination of mobile data processing, multimedia performance, 3G wireless connectivity and the lowest levels of power consumption for all-day battery life.

The Company will be demonstrating the Snapdragon platform running both Windows Mobile and Linux to deliver productivity applications, entertainment applications and advanced user experiences at Qualcomm's New York Analyst Meeting.

"HTC and Qualcomm have been working together for many years on raising the bar for the mobile market, pushing forward on delivering new capabilities and a better user experience," said Peter Chou, president and CEO, HTC Corporation. "We are happy to be working together with Qualcomm on this groundbreaking new Snapdragon solution, which will bring a new era of fully featured, customizable user experiences to consumers around the world."

"As we expand from the traditional wireless handset market, Qualcomm's Snapdragon platform will be the catalyst for a new era of innovative computing and consumer wireless mobile devices," said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies. "The enthusiastic reception from leading electronics customers for our versatile gigahertz Snapdragon chipset heralds new possibilities for products blending the mobile phone, 3G wireless connectivity and computing capabilities with unsurpassed battery life."

The QSD8250 supports HSPA data rates of up to 7.2 Mbps on the downlink and 5.76 on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000(R) 1xEV-DO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with Qualcomm's sixth-generation DSP core running at 600 MHz for unsurpassed mobile performance delivering an instant-on and always-connected user experience.

Snapdragon's support for HD video decode, 12 megapixel camera, GPS, broadcast TV (using MediaFLO, DVBH-H and/or ISDB-T), Wi-Fi and Bluetooth deliver even greater opportunities for device manufacturers to design compelling mobile products that make the promise of constant, seamless connectivity in an extremely thin and small form-factor a reality.

For more information on Snapdragon, please visit: http://www.cdmatech.com/snapdragon

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Qualcomm is a registered trademark of Qualcomm Incorporated. Snapdragon is a trademark of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

CONTACT: Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-845-7571, qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications, +1-858-845-5959, corpcomm@qualcomm.com

Web site: http://www.qualcomm.com/

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