Press Release Summary:
Designed to drive market availability of normally-on (JFET, MESFET) as well as normally-off (MOSFET) transistors, XTR26020 Chipset enables users to create Half-Bridge Gate Drive block with dedicated power supply block in 120 x 32 x 10 mm mechanical size using 6-layer PCB with active and passive components on one side. Device includes isolated communication protocol, cross conduction prevention inherent mechanism, on-chip soft shut-down switch, and on-chip Miller clamp.
Original Press Release:
X-REL Semiconductor Launches the XTR26020 Chipset, Built upon Its Existing XTR26020, XTR25020 and XTR40010 Product Lines
Grenoble, France — X-REL Semiconductor has introduced its latest chipset, XTR26020, which is designed and tailored to properly drive market availability of normally-on (JFET, MESFET) as well as normally-off (MOSFET) transistors. This 2nd generation offers tremendously decreased package size that is 25% of the equivalent XTR260010 driver and reduces the quantity of required passive components by 40%. The XTR26020 has led to a first-ever compact Half Bridge solution by X-REL. Additionally, the XTR26020 driver introduces a transistor source current sense approach while maintaining backtrack compatibility with transistor de-saturation measurement strategy. XTR26020 also retains the most successful features of the XTR26010 driver, including isolated communication protocol, high switching frequency, cross conduction prevention inherent mechanism, on-chip soft shut-down switch, and on-chip Miller clamp.
For ease of scaling-up in front of greater power FET gate size, XTR25020 can be used as sidekick to the XTR26020. XTR40010 in its XTR40012-S version brings an evolution of the isolated transceiver with a smaller footprint package.
The XTR26020 chipset can be associated with an Isolated Flyback DC-DC, built upon XTR30017-FE or XTR2N0825-FE that are smaller footprint packaged versions of the respective XTR30010 and XTR2N0825 product lines.
Overall this chipset enables X-REL customers to create a complete Half-Bridge Gate Drive block with dedicated power supply block in 120mm x 32mm x 10mm mechanical size using a 6 layer PCB with active and passive components on one side (except FETs on the second side) for better thermal cooling efficiency.
This implementation demonstrates what can be achieved for Intelligent Power Modules (IPM) that require the minimization of parasitic inductances and capacitances between the driver and the power switch, as well as the minimization of the number of passive components to allow miniaturization and increased reliability.
As with other X-REL Semiconductor products, the XTR26020 chipset is able to reliably operate from -60°C to well above +230°C, with an expected lifetime of about 5 years at +230°C. Being operational at high temperatures is mandatory in applications where the environment is at elevated temperature or where a power device makes the temperature increase inside the application casing. Additionally, all X-REL Semiconductor products can be used in applications running at lower temperatures (e.g. from 100°C to 200°C) where extended lifetime is expected or where failing is not an option. For example, the expected lifetime of X-REL Semiconductor parts in a driver application operating at Tj=150°C is over 35 years.
About X-REL Semiconductor (www.x-relsemi.com)
X-REL Semiconductor is a French fabless company commercializing standard semiconductor products and ASICs, as well as customized electronic solutions for HiRel HiTemp applications in markets such as aeronautics and space, transportation and automotive, harsh environments, oil, gas and geothermal, military, energy and industrial.