Chip Scale Module adds WiMAX functionality to devices.
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Press Release Summary:
Enabling mobile broadband, 2.5 GHz WiMAX9xxx Module consists of baseband/MAC IC, RF transceiver, power amplifier, and on-board memory. Included software suite with drivers and application layer interfaces will allow content providers, manufacturers, and OEM to integrate applications, host interfaces, and operating systems. Module adds WiMax functionality to handsets, ultra mobile personal computers, personal media players, and personal navigational devices.
Original Press Release:
SyChip Introduces SyMax(TM) Family with Advanced WiMAX 2.5 GHz Chip Scale Module
Product Line Enables Next Generation of Mobile Broadband
PLANO, Texas, July 31 /-- SyChip, Inc., a leader in Radio Frequency Chip Scale Modules (CSM) and a subsidiary of Murata Manufacturing Co., Ltd., today announced the launch of its first mobile WiMAX (IEEE 802.16e- 2005) chip scale module. The WiMAX9xxx module allows handheld manufacturers to quickly design and add WiMax functionality to devices such as handsets, ultra mobile personal computers, personal media players and personal navigational devices.
The SyMax(TM) platform includes the WiMAX9xxx hardware and all the software necessary to provide a turnkey system for WiMAX enabled devices. The CSM consist of a BaseBand/MAC IC, a Radio Frequency (RF) transceiver, a Power Amplifier (PA) and on-board memory and matching components. The software suite includes drivers and Application Layer interfaces that will allow content providers, manufacturers and original equipment manufacturers the flexibility to integrate and optimize their respective applications (VoIP, Video/Audio streaming), host interfaces (SDIO, SPI, Half Mini-card) and Operating Systems (Windows Mobile, Linux).
"The SyMax(TM) family of products leverages our leadership and know how in the plug-n-play embedded space and wireless connectivity. It will provide our customers a quick time-to-market solution as well as minimize their upfront investment. We are seeing the benefits already with the chipset vendors that we are working with," said Moses Asom, SyChip co-founder and senior vice president of marketing and business development. "This directly correlates to what is happening in the market. According to IDC, WiMax technology experienced the most substantial growth in the telecommunication market, jumping 140 percent since 2005."
Engineering samples, which come in RoHS compliant packaging, will be made available in August 2007. Volume production is scheduled to begin during the second quarter of 2008.
For more information on WiMAX 9xxx or other SyChip product, visit http://www.sychip.com/products.htm.
About SyChip, Inc.
SyChip, Inc. a subsidiary of Murata Manufacturing Co., Ltd. develops and markets Chip Scale Modules, Semiconductors and Software for the wireless mobile market. The company's RF modules are differentiated due to proprietary integration and low loss silicon technologies. As a result of this integration, world-class RF system design, proprietary multifunction ASICs, software and smart utilities, SyChip's RF designs drastically reduce component count, offer very small footprints and are easy to integrate into a mobile device. Customers benefit by significantly reducing their time-to-market, increasing performance and improving reliability of their wireless devices. SyChip has received multiple awards, including Internet Telephony's 2005 Product of the Year, Deloitte's 2005 "Fast 500," the TiEcon 2005 Emerging Star Award, MobileTrax "2005 Mobility Award," finalist for the "2005 Red Herring 100," Deloitte's 2004 "Fast 500 Rising Star Award" and "Best Wireless Accessory" by Handheld Computing.
CONTACT: Sanjay Radhakrishna of SyChip, Inc., +1-972-202-8887, sanjay.radhakrishna@sychip.com
Web site: http://www.sychip.com/
