Companies to demonstrate Visidon face activation software running on CEVA-TeakLite-4 sensor fusion platform at Mobile World Congress 2014
MOUNTAIN VIEW, Calif., and OULU, Finland - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Visidon, Ltd., a developer of industry-leading facial recognition technologies for mobile and embedded platforms, today announced that the companies have partnered to develop an ultra-low power, 'always-on' face activation solution targeting mobile devices. The solution combines Visidon's face activation software with the CEVA-TeakLite-4 sensor fusion platform to enable highly power efficient context aware applications that can activate a smartphone, tablet or any other camera-enabled device upon detecting the presence of a user's face. CEVA and Visidon will demonstrate this solution at the upcoming Mobile World Congress in CEVA's booth (Hall 6, stand A50).
Face activation technology is set to become a key component of low-power sensor fusion applications, where a device can remain in standby mode while awaiting activation via visual presence or voice commands. In mobile devices, implementing these 'always-on' technologies utilizing absolute minimal power consumption is crucial, resulting in longer battery life for the device. By utilizing the CEVA-TeakLite-4 sensor fusion platform rather than the main device CPU to implement Visidon's face activation software consumes less than 1mA at a 28nm process. In addition, by only using a fraction of the CEVA-TeakLite-4 available MHz, there is ample headroom on the processor to run additional applications in parallel, such as 'always-listening' voice activation.
"We are pleased to partner with CEVA to offer our face activation technology optimized for the CEVA-TeakLite-4 sensor fusion platform," said Markus Turtinen, CEO of Visidon. "CEVA's low-power leadership in DSP is key to bringing 'always-on' technologies to smartphones and wearable devices and we look forward to extending our partnership to address the growing demand for other face technologies in mobile devices."
"Ultra-low power consumption is the primary consideration for OEMs when adopting sensor fusion technologies for their future mobile devices, and our partnership with Visidon for an 'always-on' face activation solution meets the most stringent power requirements," said Eran Briman, vice president of marketing at CEVA. "With the addition of Visidon to our ecosystem of software partners, we are further enhancing the range of unique and differentiating solutions that our CEVA-TeakLite-4 sensor fusion platform can offer to improve the overall user experience of any device."
Mobile World Congress 2014 takes place in Barcelona, Spain from February 24th to 27th. CEVA will be located at stand A50 in Hall 6. For a preview of technologies that CEVA and its partners will showcase at Mobile World Congress, visit CEVA's virtual booth online at http://events.ceva-dsp.com/mwc14. To request a meeting with CEVA please email firstname.lastname@example.org or contact your local CEVA sales office.
Visidon develops industry-leading facial recognition technologies for mobile and embedded platforms. Visidon's technology is optimized both in accuracy and computation performance. Lightweight software engine, easy-to-use API and customizable products make our software solutions perfect for device manufacturers, chip makers and system integrators. All the major mobile platforms and operating systems are supported in our technologies. In addition, we support various large scale face recognition deployments with our cloud-based solution. For more information, visit www.visidon.fi.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, digital home and networking markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2013, CEVA's IP was shipped in over 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
Contact: Richard Kingston, CEVA, Inc., 650-417-7976, email@example.com
Web Site: http://www.ceva-dsp.com